EP2C35F484I6N vs EP2C35F484I8N Vergleich

Detaillierter Direktvergleich von EP2C35F484I6N von Intel und EP2C35F484I8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2C35F484I6N EP2C35F484I8N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $52,10 $56,01
Logic Elements 33,216 33,216
Logic Array Blocks (LABs) 2,100 —
Total RAM Bits 483,840 bits (483.84 Kbit on-chip) 483,840
Embedded 18x18 Multipliers 35 (Cyclone II family maximum 150) —
Phase-Locked Loops (PLLs) 4 —
Maximum User I/O Pins 322 (package-dependent; FBGA-484 supports up to 322 user I/O) —
Gehäuse 484-ball FBGA (Fine-Pitch BGA) 484-BGA (FineLine BGA)
Logic Family CMOS —
Core Supply Voltage 1.2 V —
Betriebstemperaturbereich -40C to +85C (industrial) —
Maximum Internal Clock Frequency 402.5 MHz —
Process Node 90 nm TSMC CMOS —
Montageart Surface Mount (BGA) Surface Mount
RoHS-Status Compliant Compliant (Pb-free)
Configuration Method Serial / Parallel (via Altera/Intel configuration device or JTAG) —
Series — Cyclone II
Family — Cyclone II EP2C35
Number of Logic Cells / Gates — 33,216
Number of I/O — 322 max user I/O
Number of LABs/CLBs — [DATA_NEEDED: LAB count]
Embedded Memory — 483,840 bits (M4K blocks)
Number of PLLs — 4
Betriebstemperatur — -40C to +100C (industrial, I8)
Process Technology — 90 nm CMOS
Core Voltage — 1.2 V (typical)
Configuration Mode — AS / PS / JTAG / FPP
MSL-Level — [DATA_NEEDED: MSL level]
Lead Free — Yes

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