EP2C35F484I6N vs EP2C35F484I8N Comparaison
Comparaison détaillée côte à côte de EP2C35F484I6N par Intel et EP2C35F484I8N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2C35F484I6N | EP2C35F484I8N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $52,10 | $56,01 |
| Logic Elements | 33,216 | 33,216 |
| Logic Array Blocks (LABs) | 2,100 | — |
| Total RAM Bits | 483,840 bits (483.84 Kbit on-chip) | 483,840 |
| Embedded 18x18 Multipliers | 35 (Cyclone II family maximum 150) | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Maximum User I/O Pins | 322 (package-dependent; FBGA-484 supports up to 322 user I/O) | — |
| Boîtier | 484-ball FBGA (Fine-Pitch BGA) | 484-BGA (FineLine BGA) |
| Logic Family | CMOS | — |
| Core Supply Voltage | 1.2 V | — |
| Plage de température de fonctionnement | -40C to +85C (industrial) | — |
| Maximum Internal Clock Frequency | 402.5 MHz | — |
| Process Node | 90 nm TSMC CMOS | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Statut RoHS | Compliant | Compliant (Pb-free) |
| Configuration Method | Serial / Parallel (via Altera/Intel configuration device or JTAG) | — |
| Series | — | Cyclone II |
| Family | — | Cyclone II EP2C35 |
| Number of Logic Cells / Gates | — | 33,216 |
| Number of I/O | — | 322 max user I/O |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| Embedded Memory | — | 483,840 bits (M4K blocks) |
| Number of PLLs | — | 4 |
| Température de fonctionnement | — | -40C to +100C (industrial, I8) |
| Process Technology | — | 90 nm CMOS |
| Core Voltage | — | 1.2 V (typical) |
| Configuration Mode | — | AS / PS / JTAG / FPP |
| Niveau MSL | — | [DATA_NEEDED: MSL level] |
| Lead Free | — | Yes |