EP2C35F484I6N vs EP2C35F484I8N Comparación
Comparación detallada lado a lado de EP2C35F484I6N por Intel y EP2C35F484I8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2C35F484I6N | EP2C35F484I8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $52,10 | $56,01 |
| Logic Elements | 33,216 | 33,216 |
| Logic Array Blocks (LABs) | 2,100 | — |
| Total RAM Bits | 483,840 bits (483.84 Kbit on-chip) | 483,840 |
| Embedded 18x18 Multipliers | 35 (Cyclone II family maximum 150) | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Maximum User I/O Pins | 322 (package-dependent; FBGA-484 supports up to 322 user I/O) | — |
| Encapsulado | 484-ball FBGA (Fine-Pitch BGA) | 484-BGA (FineLine BGA) |
| Logic Family | CMOS | — |
| Core Supply Voltage | 1.2 V | — |
| Rango de temperatura de funcionamiento | -40C to +85C (industrial) | — |
| Maximum Internal Clock Frequency | 402.5 MHz | — |
| Process Node | 90 nm TSMC CMOS | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant (Pb-free) |
| Configuration Method | Serial / Parallel (via Altera/Intel configuration device or JTAG) | — |
| Series | — | Cyclone II |
| Family | — | Cyclone II EP2C35 |
| Number of Logic Cells / Gates | — | 33,216 |
| Number of I/O | — | 322 max user I/O |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| Embedded Memory | — | 483,840 bits (M4K blocks) |
| Number of PLLs | — | 4 |
| Temperatura de funcionamiento | — | -40C to +100C (industrial, I8) |
| Process Technology | — | 90 nm CMOS |
| Core Voltage | — | 1.2 V (typical) |
| Configuration Mode | — | AS / PS / JTAG / FPP |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |
| Lead Free | — | Yes |