EP2S130F1020C3NGA vs EP2S180F1020C3 Vergleich

Detaillierter Direktvergleich von EP2S130F1020C3NGA von Intel und EP2S180F1020C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2S130F1020C3NGA EP2S180F1020C3
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.395,00 $1.280,00
Family Stratix II —
Logic Elements (LE) 132,540 —
Logic Array Blocks (LABs) 6,627 8,970
Embedded Memory (TriMatrix) 6,747,840 bits (6.7 Mbits) —
Embedded DSP Blocks Yes (18x18 multiplier blocks) —
User I/Os 742 —
Process Technology 90 nm —
Core Voltage 1.2 V 1.2 V
Maximum Internal Clock Frequency 778.82 MHz —
Gehäuse 1020-ball FC-FBGA 1020-ball FBGA (flip-chip BGA)
Speed Grade C3 C3
Temperature Grade Commercial (0C to +85C) —
PLLs 12 (8 fast PLLs + 4 enhanced PLLs) —
Configuration Modes PS, PPS, PPA, JTAG —
Configuration Encryption 128-bit AES —
RoHS-Status [DATA_NEEDED: rohs status] [DATA_NEEDED: RoHS status]
On-chip Termination (OCT) Yes (series, parallel, dynamic) —
Series — Stratix II
Device Family — EP2S180
Equivalent Logic Elements (LEs) — 179,400
Embedded Memory (RAM bits) — 9,383,040
Maximum User I/Os — 742
Montageart — Surface Mount
Process Node — 90 nm, all-layer copper SRAM
Betriebstemperatur — Commercial (0C to +85C)
DSP Blocks — Dedicated high-speed multipliers
Memory Interfaces Supported — DDR2 SDRAM, QDRII SRAM, RLDRAM II
I/O Standards — LVDS, LVPECL, SSTL, HSTL
Configuration Method — SRAM-based (volatile, requires boot device)
Development Toolchain — Quartus II / Quartus Prime

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