EP2S130F1020C3NGA vs EP2S180F1020C3 对比

详细并排对比 EP2S130F1020C3NGA 出自 Intel 和 EP2S180F1020C3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP2S130F1020C3NGA EP2S180F1020C3
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 Obsolete
库存状态 有库存 有库存
单价(USD) $1,395.00 $1,280.00
Family Stratix II —
Logic Elements (LE) 132,540 —
Logic Array Blocks (LABs) 6,627 8,970
Embedded Memory (TriMatrix) 6,747,840 bits (6.7 Mbits) —
Embedded DSP Blocks Yes (18x18 multiplier blocks) —
User I/Os 742 —
Process Technology 90 nm —
Core Voltage 1.2 V 1.2 V
Maximum Internal Clock Frequency 778.82 MHz —
封装 1020-ball FC-FBGA 1020-ball FBGA (flip-chip BGA)
Speed Grade C3 C3
Temperature Grade Commercial (0C to +85C) —
PLLs 12 (8 fast PLLs + 4 enhanced PLLs) —
Configuration Modes PS, PPS, PPA, JTAG —
Configuration Encryption 128-bit AES —
RoHS 状态 [DATA_NEEDED: rohs status] [DATA_NEEDED: RoHS status]
On-chip Termination (OCT) Yes (series, parallel, dynamic) —
Series — Stratix II
Device Family — EP2S180
Equivalent Logic Elements (LEs) — 179,400
Embedded Memory (RAM bits) — 9,383,040
Maximum User I/Os — 742
安装类型 — Surface Mount
Process Node — 90 nm, all-layer copper SRAM
工作温度 — Commercial (0C to +85C)
DSP Blocks — Dedicated high-speed multipliers
Memory Interfaces Supported — DDR2 SDRAM, QDRII SRAM, RLDRAM II
I/O Standards — LVDS, LVPECL, SSTL, HSTL
Configuration Method — SRAM-based (volatile, requires boot device)
Development Toolchain — Quartus II / Quartus Prime

数据手册与资源

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