EP2SGX60EF1152I3N vs EP2SGX60EF1152I4 Vergleich
Detaillierter Direktvergleich von EP2SGX60EF1152I3N von Intel und EP2SGX60EF1152I4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2SGX60EF1152I3N | EP2SGX60EF1152I4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.195,00 | $1.395,00 |
| Family | Stratix II GX | — |
| Device Type | Field-Programmable Gate Array (FPGA) | — |
| Logic Elements (LEs) | 60,440 | — |
| Configurable Logic Blocks (CLBs) | 60,440 | — |
| Embedded Memory Bits | 2,544,192 bits | — |
| Internal Frequency (max) | 717 MHz | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Package Type | 1152-ball FC-FBGA | — |
| Package Size | 35 x 35 mm (1 mm ball pitch) | — |
| Number of Terminals | 1152 | — |
| Terminal Form | Ball | — |
| Temperature Grade | Industrial (-40C to +100C junction) | Industrial |
| Lead-Free | Yes | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Device Family | — | Stratix II GX |
| Logic Elements | — | 60,440 |
| Logic Cells | — | 60,440 |
| Logic Array Blocks (LABs) | — | 3,022 |
| Embedded Memory | — | 2,544,192 bits |
| User I/O Pins | — | 534 |
| Maximum Internal Frequency | — | 717 MHz (per data source) |
| Maximum Operating Frequency | — | 732.1 MHz (per data source) |
| Core Supply Voltage | — | 1.2 V |
| Gehäuse | — | 1152-ball FC-FBGA (flip-chip fine-pitch BGA) |
| Package Dimensions | — | 23 x 23 mm, 1 mm pitch (per data source) |