EP2SGX60EF1152I3N vs EP2SGX60EF1152I4 Comparaison
Comparaison détaillée côte à côte de EP2SGX60EF1152I3N par Intel et EP2SGX60EF1152I4 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2SGX60EF1152I3N | EP2SGX60EF1152I4 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 195,00 | $1 395,00 |
| Family | Stratix II GX | — |
| Device Type | Field-Programmable Gate Array (FPGA) | — |
| Logic Elements (LEs) | 60,440 | — |
| Configurable Logic Blocks (CLBs) | 60,440 | — |
| Embedded Memory Bits | 2,544,192 bits | — |
| Internal Frequency (max) | 717 MHz | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Package Type | 1152-ball FC-FBGA | — |
| Package Size | 35 x 35 mm (1 mm ball pitch) | — |
| Number of Terminals | 1152 | — |
| Terminal Form | Ball | — |
| Temperature Grade | Industrial (-40C to +100C junction) | Industrial |
| Lead-Free | Yes | — |
| Statut RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Niveau MSL | [DATA_NEEDED: MSL level] | — |
| Type de montage | Surface Mount (BGA) | Surface Mount (BGA) |
| Device Family | — | Stratix II GX |
| Logic Elements | — | 60,440 |
| Logic Cells | — | 60,440 |
| Logic Array Blocks (LABs) | — | 3,022 |
| Embedded Memory | — | 2,544,192 bits |
| User I/O Pins | — | 534 |
| Maximum Internal Frequency | — | 717 MHz (per data source) |
| Maximum Operating Frequency | — | 732.1 MHz (per data source) |
| Core Supply Voltage | — | 1.2 V |
| Boîtier | — | 1152-ball FC-FBGA (flip-chip fine-pitch BGA) |
| Package Dimensions | — | 23 x 23 mm, 1 mm pitch (per data source) |