EP2SGX60EF1152I3N vs EP2SGX60EF1152I4 Comparación
Comparación detallada lado a lado de EP2SGX60EF1152I3N por Intel y EP2SGX60EF1152I4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2SGX60EF1152I3N | EP2SGX60EF1152I4 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.195,00 | $1.395,00 |
| Family | Stratix II GX | — |
| Device Type | Field-Programmable Gate Array (FPGA) | — |
| Logic Elements (LEs) | 60,440 | — |
| Configurable Logic Blocks (CLBs) | 60,440 | — |
| Embedded Memory Bits | 2,544,192 bits | — |
| Internal Frequency (max) | 717 MHz | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Package Type | 1152-ball FC-FBGA | — |
| Package Size | 35 x 35 mm (1 mm ball pitch) | — |
| Number of Terminals | 1152 | — |
| Terminal Form | Ball | — |
| Temperature Grade | Industrial (-40C to +100C junction) | Industrial |
| Lead-Free | Yes | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Device Family | — | Stratix II GX |
| Logic Elements | — | 60,440 |
| Logic Cells | — | 60,440 |
| Logic Array Blocks (LABs) | — | 3,022 |
| Embedded Memory | — | 2,544,192 bits |
| User I/O Pins | — | 534 |
| Maximum Internal Frequency | — | 717 MHz (per data source) |
| Maximum Operating Frequency | — | 732.1 MHz (per data source) |
| Core Supply Voltage | — | 1.2 V |
| Encapsulado | — | 1152-ball FC-FBGA (flip-chip fine-pitch BGA) |
| Package Dimensions | — | 23 x 23 mm, 1 mm pitch (per data source) |