EP2SGX60EF1152I3N vs EP2SGX60EF1152I4 对比
详细并排对比 EP2SGX60EF1152I3N 出自 Intel 和 EP2SGX60EF1152I4 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2SGX60EF1152I3N | EP2SGX60EF1152I4 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,195.00 | $1,395.00 |
| Family | Stratix II GX | — |
| Device Type | Field-Programmable Gate Array (FPGA) | — |
| Logic Elements (LEs) | 60,440 | — |
| Configurable Logic Blocks (CLBs) | 60,440 | — |
| Embedded Memory Bits | 2,544,192 bits | — |
| Internal Frequency (max) | 717 MHz | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Package Type | 1152-ball FC-FBGA | — |
| Package Size | 35 x 35 mm (1 mm ball pitch) | — |
| Number of Terminals | 1152 | — |
| Terminal Form | Ball | — |
| Temperature Grade | Industrial (-40C to +100C junction) | Industrial |
| Lead-Free | Yes | — |
| RoHS 状态 | Compliant | [DATA_NEEDED: RoHS status] |
| MSL 等级 | [DATA_NEEDED: MSL level] | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount (BGA) |
| Device Family | — | Stratix II GX |
| Logic Elements | — | 60,440 |
| Logic Cells | — | 60,440 |
| Logic Array Blocks (LABs) | — | 3,022 |
| Embedded Memory | — | 2,544,192 bits |
| User I/O Pins | — | 534 |
| Maximum Internal Frequency | — | 717 MHz (per data source) |
| Maximum Operating Frequency | — | 732.1 MHz (per data source) |
| Core Supply Voltage | — | 1.2 V |
| 封装 | — | 1152-ball FC-FBGA (flip-chip fine-pitch BGA) |
| Package Dimensions | — | 23 x 23 mm, 1 mm pitch (per data source) |