EP3C10F256I7 vs EP3C16F256I7N Vergleich

Detaillierter Direktvergleich von EP3C10F256I7 von Intel und EP3C16F256I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3C10F256I7 EP3C16F256I7N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Aktiv
Device Type Cyclone III Field Programmable Gate Array (FPGA) —
Logic Cells 10,320 logic cells —
Embedded Memory 423,936 bits 56 M9K blocks (504 Kbit)
I/O Count 182 I/O pins —
Total Terminals 256 terminals —
Package Type 256-LBGA —
Package Family LBGA —
Package Shape Square —
Montageart Surface Mount —
Terminal Form Ball —
Betriebstemperatur -40°C to +125°C -40C to +100C (industrial, I7)
Temperature Grade Industrial —
Versorgungsspannung [DATA_NEEDED: supply voltage range] —
Core Voltage [DATA_NEEDED: core voltage] —
I/O Standard [DATA_NEEDED: supported I/O standards] —
Configuration Interface [DATA_NEEDED: configuration interfaces] —
Lead-Free Status Lead Free —
RoHS-Status [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
Manufacturer Family Cyclone III —
Logic Block Count 10,320 logic blocks —
Family — Cyclone III
Logic Elements (LEs) — 15408
Logic Array Blocks (LABs) — 963
Total Memory Bits — 516096
Embedded 18x18 Multipliers — 56
PLLs — 4
Maximum User I/O Pins — 168
Gehäuse — 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch)
Supply Voltage (Core) — 1.2 V typical
Process Technology — TSMC 60 nm low-leakage
Configuration — SRAM-based, requires external config device (EPCS/EPCQ)
Lead-Free / Pb-Free — Yes (N suffix per JEDEC JESD97)
RoHS Compliance — Compliant

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