EP3C10F256I7 vs EP3C16F256I7N 比較
詳細並排比較 EP3C10F256I7 由 Intel 與 EP3C16F256I7N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3C10F256I7 | EP3C16F256I7N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | 啟用中 |
| Device Type | Cyclone III Field Programmable Gate Array (FPGA) | — |
| Logic Cells | 10,320 logic cells | — |
| Embedded Memory | 423,936 bits | 56 M9K blocks (504 Kbit) |
| I/O Count | 182 I/O pins | — |
| Total Terminals | 256 terminals | — |
| Package Type | 256-LBGA | — |
| Package Family | LBGA | — |
| Package Shape | Square | — |
| 安裝類型 | Surface Mount | — |
| Terminal Form | Ball | — |
| 工作溫度 | -40°C to +125°C | -40C to +100C (industrial, I7) |
| Temperature Grade | Industrial | — |
| 供應電壓 | [DATA_NEEDED: supply voltage range] | — |
| Core Voltage | [DATA_NEEDED: core voltage] | — |
| I/O Standard | [DATA_NEEDED: supported I/O standards] | — |
| Configuration Interface | [DATA_NEEDED: configuration interfaces] | — |
| Lead-Free Status | Lead Free | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Manufacturer Family | Cyclone III | — |
| Logic Block Count | 10,320 logic blocks | — |
| Family | — | Cyclone III |
| Logic Elements (LEs) | — | 15408 |
| Logic Array Blocks (LABs) | — | 963 |
| Total Memory Bits | — | 516096 |
| Embedded 18x18 Multipliers | — | 56 |
| PLLs | — | 4 |
| Maximum User I/O Pins | — | 168 |
| 封裝 | — | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Supply Voltage (Core) | — | 1.2 V typical |
| Process Technology | — | TSMC 60 nm low-leakage |
| Configuration | — | SRAM-based, requires external config device (EPCS/EPCQ) |
| Lead-Free / Pb-Free | — | Yes (N suffix per JEDEC JESD97) |
| RoHS Compliance | — | Compliant |