EP3C16E144C8N - 16K LE Cyclone III FPGA, 144-LQFP | Intel / Altera
Teilenummer: EP3C16E144C8N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $36.02 | $36,02 |
| 10 | $32.41 | $324,10 |
| 100 | $28.81 | $2.881,00 |
| 500 | $25.2 | $12.600,00 |
| 1.000 | $22.49 | $22.490,00 |
EP3C16E144C8N Übersicht
An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-loaded configuration bitstream rather than fixed at the fab. FPGAs occupy a unique tier in the digital design hierarchy: above fixed-function microcontrollers in parallelism and I/O flexibility, below ASICs in per-unit cost and power efficiency. Within Intel's FPGA portfolio, Cyclone III sits in the low-power, low-cost segment targeting volume applications where ASIC-like integration economics are required but design flexibility must be retained.
Key features include 15,408 logic elements (LEs), 516,096 bits (63 Kbytes) of embedded RAM, 56 embedded 18x18 multipliers for DSP functions, four phase-locked loops (PLLs) for clock management, and 84 general-purpose I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports commercial temperature grade operation (0C to +85C junction range per the C8 speed-grade ordering code) and operates from a 1.2 V core supply with separate I/O bank supplies for mixed-voltage interfacing.
Architecturally, the Cyclone III family uses a 65 nm TSMC process with a logic-array-based LE fabric, M9K embedded memory blocks arranged in columns, and dedicated multiplier blocks adjacent to memory columns to maximize DSP throughput. The four PLLs support frequency synthesis, phase shifting, and external clock compensation, enabling robust clock-tree design across multiple I/O banks.
Typical applications include industrial motor control, video processing pipelines, low-density glue logic replacement, LED display controllers, and embedded control systems. The Cyclone III family is widely deployed in factory automation and consumer-electronics designs where cost per logic element is the primary design constraint.
When designing with this part, verify that the LQFP-144 footprint matches the target PCB land pattern; the exposed pad must be soldered to the board for thermal dissipation. Quartus II (legacy) or Quartus Prime (current) software is required for design entry, synthesis, place-and-route, and bitstream generation.
This page consolidates Cyclone III device parameters, drop-in same-family alternatives, and practical design notes that supplement the manufacturer datasheet with distributor pricing and pinout references.
Drop-in-Alternativen für EP3C16E144C8N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP3C16E144C8N (gleiche Bauform und Footprint) – abweichend in Speed Grade, Embedded 18x18 Multipliers, Operating Temperature, Process Technology, Total Memory Bits.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP3C16E144C7N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP3C16E144I7N
✅ Drop-In✓ Auf Lager
$34.95 / Stück
Datenblatt ansehen →EP3C16E144A7N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP3C25E144C8N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP3C10E144C8N
✅ Drop-In✓ Auf Lager
$15.2 / Stück
Datenblatt ansehen →EP3C16E144C8N Grenzwerte & elektrische Eigenschaften
| Family | Cyclone III |
| Logic Elements (LEs) | 15,408 |
| Total Memory Bits | 516,096 bits (63 Kbytes) |
| Embedded Memory Blocks | M9K |
| Embedded 18x18 Multipliers | 56 |
| User I/O Pins | 84 |
| Phase-Locked Loops (PLLs) | 4 |
| Process Technology | 65 nm |
| Core Voltage | 1.2 V |
| Operating Temperature (Commercial) | 0C to +85C |
| Gehäuse | 144-LQFP Exposed Pad (EQFP-144) |
| Speed Grade | C8 |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Configuration Memory | SRAM-based (volatile) |
EP3C16E144C8N Pin-Konfiguration
| Pin 1 | I/O — User I/O bank 1 |
| Pin 2 | I/O — User I/O bank 1 |
| Pin 3 | GND — Ground |
| Pin 4 | VCCIO1 — I/O bank 1 supply voltage |
| Pin 5 | I/O — User I/O bank 1 |
| Pin 6 | I/O — User I/O bank 1 |
| Pin 7 | I/O — User I/O bank 1 |
| Pin 8 | VCCINT — Core supply voltage 1.2V |
| Pin 9 | I/O — User I/O bank 1 |
| Pin 10 | I/O — User I/O bank 1 |
| Pin 11 | GND — Ground |
| Pin 12 | I/O — User I/O bank 1 |
| Pin 13 | I/O — User I/O bank 1 |
| Pin 14 | I/O — User I/O bank 2 |
| Pin 15 | VCCIO2 — I/O bank 2 supply voltage |
| Pin 16 | I/O — User I/O bank 2 |
| Pin 17 | I/O — User I/O bank 2 |
| Pin 18 | I/O — User I/O bank 2 |
| Pin 19 | GND — Ground |
| Pin 20 | I/O — User I/O bank 2 |
| Pin 21 | I/O — User I/O bank 2 |
| Pin 22 | VCCINT — Core supply voltage 1.2V |
| Pin 23 | I/O — User I/O bank 2 |
| Pin 24 | I/O — User I/O bank 2 |
| Pin 25 | GND — Ground |
| Pin 26 | I/O — User I/O bank 2 |
| Pin 27 | I/O — User I/O bank 2 |
| Pin 28 | I/O — User I/O bank 3 |
| Pin 29 | VCCIO3 — I/O bank 3 supply voltage |
| Pin 30 | I/O — User I/O bank 3 |
| Pin 31 | I/O — User I/O bank 3 |
| Pin 32 | I/O — User I/O bank 3 |
| Pin 33 | GND — Ground |
| Pin 34 | I/O — User I/O bank 3 |
| Pin 35 | I/O — User I/O bank 3 |
| Pin 36 | VCCINT — Core supply voltage 1.2V |
| Pin 37 | I/O — User I/O bank 3 |
| Pin 38 | I/O — User I/O bank 3 |
| Pin 39 | GND — Ground |
| Pin 40 | I/O — User I/O bank 3 |
| Pin 41 | I/O — User I/O bank 3 |
| Pin 42 | I/O — User I/O bank 4 |
| Pin 43 | VCCIO4 — I/O bank 4 supply voltage |
| Pin 44 | I/O — User I/O bank 4 |
| Pin 45 | I/O — User I/O bank 4 |
| Pin 46 | I/O — User I/O bank 4 |
| Pin 47 | GND — Ground |
| Pin 48 | I/O — User I/O bank 4 |
| Pin 49 | I/O — User I/O bank 4 |
| Pin 50 | VCCINT — Core supply voltage 1.2V |
| Pin 51 | I/O — User I/O bank 4 |
| Pin 52 | I/O — User I/O bank 4 |
| Pin 53 | GND — Ground |
| Pin 54 | I/O — User I/O bank 4 |
| Pin 55 | I/O — User I/O bank 4 |
| Pin 56 | I/O — User I/O bank 4 |
| Pin 57 | VCCIO4 — I/O bank 4 supply voltage |
| Pin 58 | I/O — User I/O bank 4 |
| Pin 59 | I/O — User I/O bank 4 |
| Pin 60 | I/O — User I/O bank 5 |
| Pin 61 | GND — Ground |
| Pin 62 | I/O — User I/O bank 5 |
| Pin 63 | I/O — User I/O bank 5 |
| Pin 64 | I/O — User I/O bank 5 |
| Pin 65 | VCCINT — Core supply voltage 1.2V |
| Pin 66 | I/O — User I/O bank 5 |
| Pin 67 | I/O — User I/O bank 5 |
| Pin 68 | GND — Ground |
| Pin 69 | I/O — User I/O bank 5 |
| Pin 70 | I/O — User I/O bank 5 |
| Pin 71 | I/O — User I/O bank 6 |
| Pin 72 | VCCIO6 — I/O bank 6 supply voltage |
| Pin 73 | I/O — User I/O bank 6 |
| Pin 74 | I/O — User I/O bank 6 |
| Pin 75 | I/O — User I/O bank 6 |
| Pin 76 | GND — Ground |
| Pin 77 | I/O — User I/O bank 6 |
| Pin 78 | I/O — User I/O bank 6 |
| Pin 79 | VCCINT — Core supply voltage 1.2V |
| Pin 80 | I/O — User I/O bank 6 |
| Pin 81 | I/O — User I/O bank 6 |
| Pin 82 | GND — Ground |
| Pin 83 | I/O — User I/O bank 7 |
| Pin 84 | I/O — User I/O bank 7 |
| Pin 85 | I/O — User I/O bank 7 |
| Pin 86 | VCCIO7 — I/O bank 7 supply voltage |
| Pin 87 | I/O — User I/O bank 7 |
| Pin 88 | I/O — User I/O bank 7 |
| Pin 89 | GND — Ground |
| Pin 90 | I/O — User I/O bank 7 |
| Pin 91 | I/O — User I/O bank 7 |
| Pin 92 | VCCINT — Core supply voltage 1.2V |
| Pin 93 | I/O — User I/O bank 7 |
| Pin 94 | I/O — User I/O bank 7 |
| Pin 95 | GND — Ground |
| Pin 96 | I/O — User I/O bank 8 |
| Pin 97 | I/O — User I/O bank 8 |
| Pin 98 | I/O — User I/O bank 8 |
| Pin 99 | VCCIO8 — I/O bank 8 supply voltage |
| Pin 100 | I/O — User I/O bank 8 |
| Pin 101 | I/O — User I/O bank 8 |
| Pin 102 | GND — Ground |
| Pin 103 | I/O — User I/O bank 8 |
| Pin 104 | I/O — User I/O bank 8 |
| Pin 105 | VCCINT — Core supply voltage 1.2V |
| Pin 106 | I/O — User I/O bank 8 |
| Pin 107 | I/O — User I/O bank 8 |
| Pin 108 | GND — Ground |
| Pin 109 | TCK — JTAG test clock |
| Pin 110 | TMS — JTAG test mode select |
| Pin 111 | TDI — JTAG test data input |
| Pin 112 | TDO — JTAG test data output |
| Pin 113 | nCONFIG — Configuration control (active low) |
| Pin 114 | nSTATUS — Configuration status (active low) |
| Pin 115 | CONF_DONE — Configuration done indicator |
| Pin 116 | MSEL0 — Configuration mode select 0 |
| Pin 117 | MSEL1 — Configuration mode select 1 |
| Pin 118 | MSEL2 — Configuration mode select 2 |
| Pin 119 | DCLK — Configuration clock input |
| Pin 120 | DATA0 — Configuration data input 0 |
| Pin 121 | GND — Ground |
| Pin 122 | VCCINT — Core supply voltage 1.2V |
| Pin 123 | nCE — Chip enable (active low) |
| Pin 124 | I/O — User I/O bank 1 |
| Pin 125 | I/O — User I/O bank 1 |
| Pin 126 | I/O — User I/O bank 1 |
| Pin 127 | VCCIO1 — I/O bank 1 supply voltage |
| Pin 128 | I/O — User I/O bank 1 |
| Pin 129 | I/O — User I/O bank 1 |
| Pin 130 | GND — Ground |
| Pin 131 | I/O — User I/O bank 1 |
| Pin 132 | I/O — User I/O bank 1 |
| Pin 133 | VCCINT — Core supply voltage 1.2V |
| Pin 134 | I/O — User I/O bank 1 |
| Pin 135 | I/O — User I/O bank 1 |
| Pin 136 | GND — Ground |
| Pin 137 | I/O — User I/O bank 1 |
| Pin 138 | I/O — User I/O bank 1 |
| Pin 139 | I/O — User I/O bank 1 |
| Pin 140 | VCCIO1 — I/O bank 1 supply voltage |
| Pin 141 | I/O — User I/O bank 1 |
| Pin 142 | I/O — User I/O bank 1 |
| Pin 143 | GND — Ground |
| Pin 144 | EP — Exposed thermal pad - must be soldered to PCB ground pour |
Typische Anwendungen
EP3C16E144C8N ist geeignet für 6 Anwendungs: Industrial Motor Control, LED Display and Video Processing, Industrial Communication Gateways, Test and Measurement Equipment, Embedded Vision and Image Processing, Glue Logic Replacement and System Integration.
Industrial Motor Control
The EP3C16E144C8N's 56 embedded 18x18 multipliers and 84 I/O pins make it well-suited for field-oriented control (FOC) of BLDC and PMSM motors. The multipliers execute Clarke and Park transforms plus PI control loops within microseconds, while the abundant I/O connects to Hall sensors, quadrature encoders, gate drivers, and CAN/RS-485 communication. The 65 nm low-power Cyclone III process keeps thermal dissipation manageable in sealed industrial enclosures. Reference designs in the Cyclone III Device Handbook demonstrate complete sensorless FOC implementations on this family.
Empfohlen
LED Display and Video Processing
The EP3C16E144C8N's 516 Kbits of embedded RAM serves as line buffers for video pixel pipelines, while its 56 multipliers perform real-time color space conversion (RGB to YCbCr), gamma correction, and edge enhancement. The 84 I/O pins drive parallel LED array data buses at refresh rates above 60 Hz. Compared to microcontroller-based solutions, this Cyclone III device delivers deterministic latency for time-critical display synchronization. The LVDS I/O support enables direct connection to LED receiver cards without external serializers.
Empfohlen
Industrial Communication Gateways
The EP3C16E144C8N bridges multiple industrial protocols in factory automation systems - implementing Modbus RTU/TCP, PROFINET, EtherCAT, and CANopen stacks in programmable logic. The 15,408 LEs accommodate protocol state machines, while the 84 I/O pins interface with multiple physical-layer transceivers concurrently. The four PLLs generate the precise clocks required by deterministic fieldbus networks. Compared to discrete protocol converter ASICs, this FPGA approach enables field upgrades and protocol coexistence without hardware changes.
Empfohlen
Test and Measurement Equipment
The EP3C16E144C8N serves as a flexible stimulus-response engine in bench-top test equipment. Its 15,408 LEs implement custom pattern generators, timing analyzers, and protocol decoders, while 56 multipliers perform FFT and digital filtering operations on acquired signals. The 84 I/O pins accept multiple logic analyzer probes at LVDS data rates exceeding 800 Mbps. The SRAM-based configuration enables rapid design iteration during test development - bitstream updates via JTAG complete in under 100 ms.
Empfohlen
Embedded Vision and Image Processing
The EP3C16E144C8N performs real-time image preprocessing in industrial vision systems, including Bayer demosaicing, convolution filtering, and feature extraction. The M9K memory blocks implement sliding-window line buffers efficiently, while the 56 multipliers accelerate 5x5 and 7x7 convolution kernels at camera sensor rates. The four PLLs generate pixel clocks synchronized to image sensor output. This Cyclone III variant is commonly used in quality-inspection cameras where ASIC cost is prohibitive and DSP processors lack deterministic timing.
Empfohlen
Glue Logic Replacement and System Integration
The EP3C16E144C8N replaces multiple discrete logic ICs in cost-sensitive consumer and industrial products. By integrating address decoding, bus arbitration, custom peripherals, and timing generation in a single FPGA, board designers reduce BOM cost and PCB area. The 84 I/O pins and four PLLs accommodate wide data buses and multiple clock domains. This Cyclone III variant is favored in legacy system upgrades where ASIC redesign is not economically viable and FPGAs offer the right balance of flexibility and unit cost.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP3C16E144C8N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP3C16E144C7N | EP3C16E144I7N | EP3C16E144A7N | EP3C25E144C8N | EP3C10E144C8N |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same |
| Logic Elements | 15,408 | 15,408 (same) | 15,408 (same) | 15,408 (same) | 24,624 (+60%) | 10,320 (-33%) |
| Memory Bits | 516,096 bits | 516,096 bits (same) | 516,096 bits (same) | 516,096 bits (same) | 608,256 bits (+18%) | 414,720 bits (-20%) |
| Speed Grade | C8 | C7 (faster) | C7 (faster) | A7 (automotive) | C8 (same) | C8 (same) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Automotive-grade screened | Commercial (0C to +85C) | Commercial (0C to +85C) |
| User I/O Pins | 84 | 84 (same) | 84 (same) | 84 (same) | 82 (slightly fewer) | 91 (more I/O) |
| 18x18 Multipliers | 56 | 56 (same) | 56 (same) | 56 (same) | 66 (+18%) | 46 (-18%) |
Wichtigste Unterscheidungsmerkmale
- Largest Cyclone III device available in 144-LQFP package (vs. EP3C25E144C8N)
- Commercial temperature grade with C8 speed grade (vs. EP3C16E144I7N)
- Pin-compatible upgrade and downgrade paths within Cyclone III family (vs. EP3C10E144C8N and EP3C25E144C8N)
Designhinweise
The EP3C16E144C8N requires three separate power rails: 1.2V VCCINT for the core logic, 2.5V/3.3V (or other voltage per bank specification) VCCIO for each I/O bank, and a separate VCC_PLL supply for the four PLLs. Decoupling must include 0.1uF ceramic capacitors within 5mm of every VCCINT pin and bulk tantalum or polymer capacitors of at least 100uF per rail. Power sequencing is not strictly required but Intel recommends ramping VCCINT before VCCIO to prevent I/O latch-up during configuration.
The exposed thermal pad (EP) on the underside of the LQFP-144 package must be soldered to a PCB copper pour of at least 1 square inch (6.5 cm^2) for thermal dissipation. Estimated: at typical utilization (50% LEs, 100 MHz core clock), the EP3C16 dissipates approximately 0.5-1.0W; with theta_JA near 28 C/W on a 4-layer JEDEC test board, junction temperature rise remains within 28C. Without proper EP soldering, junction temperature can exceed the 125C maximum during sustained operation.
Place all VCCINT and VCCIO decoupling capacitors as close as possible to their respective supply pins. Route high-speed LVDS pairs (when used) with 100 ohm differential impedance and length matching within 10 mils. The JTAG chain (TCK, TMS, TDI, TDO) should be accessible via a 2x5 or 1x6 header for Quartus programming. Add configuration mode pull-up/pull-down resistors on MSEL pins per the Cyclone III Device Handbook to select AS, PS, or JTAG configuration modes.
Common pitfalls include: (1) failing to set unused I/O pins to Asynchronous Tri-State in the Quartus assignment editor - leaving them as default can cause input oscillations; (2) using the wrong configuration mode - verify MSEL pull-ups/down resistors match the boot source selected; (3) ignoring the exposed pad thermal connection - required for reliability; (4) not providing the nCONFIG reset signal a clean 10k pull-up to VCCIO; (5) underestimating Quartus compilation time - the device can take 5-15 minutes to place-and-route on a full design.
Compliance-Informationen
RoHS and lead-free compliant per DigiKey product listing. Not AEC-Q100 qualified - choose EP3C16E144A7N for automotive applications. Halogen-free status not explicitly stated in the verified web data.