EP3C16F256C8 vs EP3C16F256I7N Vergleich

Detaillierter Direktvergleich von EP3C16F256C8 von Intel und EP3C16F256I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3C16F256C8 EP3C16F256I7N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Aktiv
Device Type Cyclone III Field-Programmable Gate Array (FPGA) —
Logic Elements 15,408 logic elements —
Embedded Memory 516,096 bits (504 Kb) 56 M9K blocks (504 Kbit)
Maximum Frequency 402 MHz —
I/O Pins 168 pins —
Process Technology 65 nm CMOS TSMC 60 nm low-leakage
Core Supply Voltage 1.2 V —
Gehäuse 256-LBGA (F256) 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch)
Package Dimensions 17 mm × 17 mm —
Number of Package Terminals 256 balls —
Montagestil Surface mount —
Speed Grade Grade 8 —
Commercial Junction Temperature 0 °C to 85 °C —
Industrial Junction Temperature -40 °C to 125 °C —
Package Outline Reference MS-034 —
Lead-Free Status Lead free —
Terminal Form Ball-grid array —
Programmable Logic Family Cyclone III —
RoHS Compliance [DATA_NEEDED: RoHS compliance] Compliant
REACH Compliance [DATA_NEEDED: REACH compliance] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Family — Cyclone III
Logic Elements (LEs) — 15408
Logic Array Blocks (LABs) — 963
Total Memory Bits — 516096
Embedded 18x18 Multipliers — 56
PLLs — 4
Maximum User I/O Pins — 168
Betriebstemperatur — -40C to +100C (industrial, I7)
Supply Voltage (Core) — 1.2 V typical
Configuration — SRAM-based, requires external config device (EPCS/EPCQ)
Lead-Free / Pb-Free — Yes (N suffix per JEDEC JESD97)

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