EP3C16F256C8 vs EP3C16F256I7N 对比
详细并排对比 EP3C16F256C8 出自 Intel 和 EP3C16F256I7N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3C16F256C8 | EP3C16F256I7N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | 有效 |
| Device Type | Cyclone III Field-Programmable Gate Array (FPGA) | — |
| Logic Elements | 15,408 logic elements | — |
| Embedded Memory | 516,096 bits (504 Kb) | 56 M9K blocks (504 Kbit) |
| Maximum Frequency | 402 MHz | — |
| I/O Pins | 168 pins | — |
| Process Technology | 65 nm CMOS | TSMC 60 nm low-leakage |
| Core Supply Voltage | 1.2 V | — |
| 封装 | 256-LBGA (F256) | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Package Dimensions | 17 mm × 17 mm | — |
| Number of Package Terminals | 256 balls | — |
| 安装方式 | Surface mount | — |
| Speed Grade | Grade 8 | — |
| Commercial Junction Temperature | 0 °C to 85 °C | — |
| Industrial Junction Temperature | -40 °C to 125 °C | — |
| Package Outline Reference | MS-034 | — |
| Lead-Free Status | Lead free | — |
| Terminal Form | Ball-grid array | — |
| Programmable Logic Family | Cyclone III | — |
| RoHS Compliance | [DATA_NEEDED: RoHS compliance] | Compliant |
| REACH Compliance | [DATA_NEEDED: REACH compliance] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Family | — | Cyclone III |
| Logic Elements (LEs) | — | 15408 |
| Logic Array Blocks (LABs) | — | 963 |
| Total Memory Bits | — | 516096 |
| Embedded 18x18 Multipliers | — | 56 |
| PLLs | — | 4 |
| Maximum User I/O Pins | — | 168 |
| 工作温度 | — | -40C to +100C (industrial, I7) |
| Supply Voltage (Core) | — | 1.2 V typical |
| Configuration | — | SRAM-based, requires external config device (EPCS/EPCQ) |
| Lead-Free / Pb-Free | — | Yes (N suffix per JEDEC JESD97) |