EP3C16F256C8 vs EP3C16F256I7N 비교
다음의 상세 나란히 비교: EP3C16F256C8 제조: Intel 및 EP3C16F256I7N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP3C16F256C8 | EP3C16F256I7N |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | Obsolete | 활성 |
| Device Type | Cyclone III Field-Programmable Gate Array (FPGA) | — |
| Logic Elements | 15,408 logic elements | — |
| Embedded Memory | 516,096 bits (504 Kb) | 56 M9K blocks (504 Kbit) |
| Maximum Frequency | 402 MHz | — |
| I/O Pins | 168 pins | — |
| Process Technology | 65 nm CMOS | TSMC 60 nm low-leakage |
| Core Supply Voltage | 1.2 V | — |
| 패키지 | 256-LBGA (F256) | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Package Dimensions | 17 mm × 17 mm | — |
| Number of Package Terminals | 256 balls | — |
| 장착 스타일 | Surface mount | — |
| Speed Grade | Grade 8 | — |
| Commercial Junction Temperature | 0 °C to 85 °C | — |
| Industrial Junction Temperature | -40 °C to 125 °C | — |
| Package Outline Reference | MS-034 | — |
| Lead-Free Status | Lead free | — |
| Terminal Form | Ball-grid array | — |
| Programmable Logic Family | Cyclone III | — |
| RoHS Compliance | [DATA_NEEDED: RoHS compliance] | Compliant |
| REACH Compliance | [DATA_NEEDED: REACH compliance] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Family | — | Cyclone III |
| Logic Elements (LEs) | — | 15408 |
| Logic Array Blocks (LABs) | — | 963 |
| Total Memory Bits | — | 516096 |
| Embedded 18x18 Multipliers | — | 56 |
| PLLs | — | 4 |
| Maximum User I/O Pins | — | 168 |
| 동작 온도 | — | -40C to +100C (industrial, I7) |
| Supply Voltage (Core) | — | 1.2 V typical |
| Configuration | — | SRAM-based, requires external config device (EPCS/EPCQ) |
| Lead-Free / Pb-Free | — | Yes (N suffix per JEDEC JESD97) |