EP3C25F324C7 vs EP3C25F324C7N Vergleich

Detaillierter Direktvergleich von EP3C25F324C7 von Intel und EP3C25F324C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3C25F324C7 EP3C25F324C7N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Cyclone III —
Logic Elements 24,624 —
Memory Bits 608,256 bits —
Number of I/O 215 —
Package Type 324-BGA —
Package Code BGA BGA
Number of Terminals 324 —
Package Shape Square Rectangular
Terminal Form Ball Ball
Montageart Surface Mount Surface Mount
Operating Voltage Range [DATA_NEEDED: operating voltage range] —
Maximum Operating Frequency [DATA_NEEDED: maximum operating frequency] —
Betriebstemperaturbereich [DATA_NEEDED: operating temperature range] —
Internal Memory Configuration [DATA_NEEDED: internal memory configuration] —
I/O Standard [DATA_NEEDED: supported I/O standards] —
RoHS Compliance [DATA_NEEDED: RoHS compliance] —
REACH Compliance [DATA_NEEDED: REACH compliance] —
Lead-Free Status [DATA_NEEDED: lead-free status] —
Product Type — Field Programmable Gate Array (FPGA)
Device Family — Cyclone III
Logic Cells — 24,624 cells
Embedded Memory — 608,256 bits
Available I/O Pins — 215 I/O
Maximum Listed Frequency — 437.5 MHz
Process Technology — 65 nm
Core Voltage — 1.2 V
Gehäuse — 324-ball FBGA
Terminal Count — 324 terminals
Temperature Grading — Other
Programmability — Field programmable
RoHS-Status — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]

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