EP3C25F324C7 vs EP3C25F324C7N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C25F324C7 disebabkan oleh Intel dan EP3C25F324C7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3C25F324C7 EP3C25F324C7N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Cyclone III —
Logic Elements 24,624 —
Memory Bits 608,256 bits —
Number of I/O 215 —
Package Type 324-BGA —
Package Code BGA BGA
Number of Terminals 324 —
Package Shape Square Rectangular
Terminal Form Ball Ball
Jenis Pemasangan Surface Mount Surface Mount
Operating Voltage Range [DATA_NEEDED: operating voltage range] —
Maximum Operating Frequency [DATA_NEEDED: maximum operating frequency] —
Gambaran Suhu Operasi [DATA_NEEDED: operating temperature range] —
Internal Memory Configuration [DATA_NEEDED: internal memory configuration] —
I/O Standard [DATA_NEEDED: supported I/O standards] —
RoHS Compliance [DATA_NEEDED: RoHS compliance] —
REACH Compliance [DATA_NEEDED: REACH compliance] —
Lead-Free Status [DATA_NEEDED: lead-free status] —
Product Type — Field Programmable Gate Array (FPGA)
Device Family — Cyclone III
Logic Cells — 24,624 cells
Embedded Memory — 608,256 bits
Available I/O Pins — 215 I/O
Maximum Listed Frequency — 437.5 MHz
Process Technology — 65 nm
Core Voltage — 1.2 V
Kemasan — 324-ball FBGA
Terminal Count — 324 terminals
Temperature Grading — Other
Programmability — Field programmable
Status RoHS — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]

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