EP3C25F324C8N vs EP3C25F324C6N Vergleich
Detaillierter Direktvergleich von EP3C25F324C8N von Intel und EP3C25F324C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C25F324C8N | EP3C25F324C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $27,10 | $62,30 |
| Family | Cyclone III | Cyclone III (low-power, low-cost FPGA) |
| Series | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 24,624 | — |
| Total Memory Bits | 608,256 bits | 608,256 bits |
| Embedded Memory (Kbits) | 608 Kbits | — |
| Number of I/O | 215 | — |
| Gehäuse | 324-BGA (FineLine) | 324-BGA (FBGA-324), fine-pitch |
| Supply Voltage - Core | 1.2 V | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | 0 C to +85 C (commercial, suffix C) | 0C to +85C (commercial) |
| Speed Grade | 8 | C6 (commercial) |
| Total RAM Bits | 608,256 | — |
| Process Node | 60 nm low-power CMOS | — |
| Number of Multipliers (18x18) | 66 | — |
| Number of PLLs | 4 | — |
| RoHS-Status | Compliant | — |
| Logic Elements (LE) | — | 24,624 |
| Embedded Memory Blocks | — | M9K blocks, 66 total |
| Embedded Multipliers | — | 66 (18x18) |
| DSP Blocks | — | 66 dedicated 18x18 multipliers |
| User I/O Pins | — | 215 |
| Number of I/O Banks | — | 8 |
| PLLs | — | 4 general-purpose PLLs |
| Process Technology | — | TSMC 65 nm low-power (LP) |
| Configuration Schemes | — | Passive Serial, Fast Passive Parallel, JTAG |
| Lead-Free / RoHS | — | Yes (lead-free, RoHS compliant) |