EP3C25F324C8N vs EP3C25F324C6N Comparación
Comparación detallada lado a lado de EP3C25F324C8N por Intel y EP3C25F324C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C25F324C8N | EP3C25F324C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $27,10 | $62,30 |
| Family | Cyclone III | Cyclone III (low-power, low-cost FPGA) |
| Series | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 24,624 | — |
| Total Memory Bits | 608,256 bits | 608,256 bits |
| Embedded Memory (Kbits) | 608 Kbits | — |
| Number of I/O | 215 | — |
| Encapsulado | 324-BGA (FineLine) | 324-BGA (FBGA-324), fine-pitch |
| Supply Voltage - Core | 1.2 V | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | 0 C to +85 C (commercial, suffix C) | 0C to +85C (commercial) |
| Speed Grade | 8 | C6 (commercial) |
| Total RAM Bits | 608,256 | — |
| Process Node | 60 nm low-power CMOS | — |
| Number of Multipliers (18x18) | 66 | — |
| Number of PLLs | 4 | — |
| Estado RoHS | Compliant | — |
| Logic Elements (LE) | — | 24,624 |
| Embedded Memory Blocks | — | M9K blocks, 66 total |
| Embedded Multipliers | — | 66 (18x18) |
| DSP Blocks | — | 66 dedicated 18x18 multipliers |
| User I/O Pins | — | 215 |
| Number of I/O Banks | — | 8 |
| PLLs | — | 4 general-purpose PLLs |
| Process Technology | — | TSMC 65 nm low-power (LP) |
| Configuration Schemes | — | Passive Serial, Fast Passive Parallel, JTAG |
| Lead-Free / RoHS | — | Yes (lead-free, RoHS compliant) |