EP3C40F324C8N vs EP3C25F324C8N Vergleich
Detaillierter Direktvergleich von EP3C40F324C8N von Intel und EP3C25F324C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C40F324C8N | EP3C25F324C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $56,20 | $27,10 |
| Series | Cyclone III | Cyclone III |
| Family | Cyclone III (EP3C40) | Cyclone III |
| Logic Elements (LE) | 39,600 | — |
| Embedded Memory (bits) | 1,161,216 (~1.16 Mbit) | — |
| Embedded 18x18 Multipliers | 126 | — |
| Maximum User I/O | 215 | — |
| PLLs | 4 | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 60 nm low-power CMOS (TSMC) | — |
| Maximum Core Frequency | 402 MHz (speed grade 8) | — |
| Betriebstemperatur | 0C to +85C (commercial, C8 suffix) | 0 C to +85 C (commercial, suffix C) |
| Configuration Method | SRAM (volatile), requires external boot device | — |
| Gehäuse | FBGA-324 (324-ball FineLine BGA) | 324-BGA (FineLine) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Logic Elements (LEs) | — | 24,624 |
| Total Memory Bits | — | 608,256 bits |
| Embedded Memory (Kbits) | — | 608 Kbits |
| Number of I/O | — | 215 |
| Supply Voltage - Core | — | 1.2 V |
| Speed Grade | — | 8 |
| Total RAM Bits | — | 608,256 |
| Process Node | — | 60 nm low-power CMOS |
| Number of Multipliers (18x18) | — | 66 |
| Number of PLLs | — | 4 |