EP3C40F324C8N vs EP3C25F324C8N Comparación
Comparación detallada lado a lado de EP3C40F324C8N por Intel y EP3C25F324C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C40F324C8N | EP3C25F324C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $56,20 | $27,10 |
| Series | Cyclone III | Cyclone III |
| Family | Cyclone III (EP3C40) | Cyclone III |
| Logic Elements (LE) | 39,600 | — |
| Embedded Memory (bits) | 1,161,216 (~1.16 Mbit) | — |
| Embedded 18x18 Multipliers | 126 | — |
| Maximum User I/O | 215 | — |
| PLLs | 4 | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 60 nm low-power CMOS (TSMC) | — |
| Maximum Core Frequency | 402 MHz (speed grade 8) | — |
| Temperatura de funcionamiento | 0C to +85C (commercial, C8 suffix) | 0 C to +85 C (commercial, suffix C) |
| Configuration Method | SRAM (volatile), requires external boot device | — |
| Encapsulado | FBGA-324 (324-ball FineLine BGA) | 324-BGA (FineLine) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Logic Elements (LEs) | — | 24,624 |
| Total Memory Bits | — | 608,256 bits |
| Embedded Memory (Kbits) | — | 608 Kbits |
| Number of I/O | — | 215 |
| Supply Voltage - Core | — | 1.2 V |
| Speed Grade | — | 8 |
| Total RAM Bits | — | 608,256 |
| Process Node | — | 60 nm low-power CMOS |
| Number of Multipliers (18x18) | — | 66 |
| Number of PLLs | — | 4 |