EP3C40F780C7 vs EP3C40F780I8N Vergleich
Detaillierter Direktvergleich von EP3C40F780C7 von Intel und EP3C40F780I8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C40F780C7 | EP3C40F780I8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $139,50 | $192,00 |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 39,600 | — |
| Number of Logic Cells | 39,600 | — |
| Total Memory Bits | 1,161,216 bits | — |
| Embedded 18x18 Multipliers | 126 | — |
| Number of PLLs | 4 | 4 |
| User I/O Count | 535 | — |
| I/O Banks | 8 | 20 |
| Gehäuse | 780-ball FBGA (F780) | 780-ball FBGA (F780) |
| Package Dimensions | 29 x 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V | — |
| Betriebstemperatur | 0C to +85C (Commercial) | — |
| Speed Grade | C7 | — |
| Process Technology | 60 nm TSMC low-power CMOS | TSMC 65 nm low-power CMOS |
| Configuration | Active Serial / Passive Parallel (JTAG) | — |
| MSL-Level | 3 (168 hours) | 3 |
| RoHS-Status | Compliant | Compliant |
| Device Logic Elements | — | 39,600 |
| Logic Array Blocks (LABs/CLBs) | — | 2,475 |
| Embedded Memory (bits) | — | 1,161,216 |
| Embedded Memory (Kbits) | — | 1,134 |
| Embedded Multipliers (18x18) | — | 126 |
| User I/O Pins | — | 535 |
| Nominal Core Supply Voltage | — | 1.2 V (1.15 V to 1.25 V) |
| Package Ball Pitch | — | 1.0 mm |
| Operating Temperature Grade | — | Industrial (-40 °C to +100 °C junction) |
| Configuration Modes | — | Passive Serial, Active Serial (EPCS), JTAG, Fast Passive Parallel |
| Montageart | — | Surface Mount (BGA) |