EP3C5U256C8N vs EP3C5U256C6N Vergleich
Detaillierter Direktvergleich von EP3C5U256C8N von Intel und EP3C5U256C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C5U256C8N | EP3C5U256C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $19,85 | $25,40 |
| Series | Cyclone III | Cyclone III |
| Family Name | Cyclone® III | — |
| Logic Elements (LE) | 5,136 | — |
| Number of CLBs | 5,136 | — |
| Number of Logic Cells | 5,136 | — |
| Total RAM Bits | 423,936 | — |
| Number of I/O | 182 | — |
| Versorgungsspannung | 1.2 V core, 1.2-3.3 V I/O | — |
| Number of Embedded Multipliers (18x18) | 46 | — |
| Number of PLLs | 4 | — |
| Maximum Operating Frequency | [DATA_NEEDED: maximum operating frequency] | — |
| Speed Grade | 8 (commercial) | C6 |
| Gehäuse | 256-UBGA (Ultra FineLine BGA) | 256-UBGA (Ultra FineLine BGA) |
| Package Dimensions | 14 x 14 mm, 0.8 mm ball pitch | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Lead Free / RoHS | Lead Free, RoHS Compliant | Yes / Compliant |
| Betriebstemperatur | 0C to +85C (commercial, "C" suffix) | — |
| Process Technology | 60 nm CMOS, SRAM-based configuration | 60 nm low-power CMOS |
| Device Family | — | Cyclone III FPGA |
| Logic Elements | — | 5,136 |
| Logic Array Blocks (LABs) | — | 321 |
| Embedded Memory | — | 423,936 bits |
| Maximum User I/Os | — | 182 |
| Package Body Size | — | 14 x 14 mm |
| Ball Pitch | — | 0.80 mm |
| Package Height | — | 2.20 mm |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Configuration Modes | — | AS, PS, JTAG, Fast Passive Parallel |