EP3C5U256C8N vs EP3C5U256C6N Comparison
Detailed side-by-side comparison of EP3C5U256C8N by Intel and EP3C5U256C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3C5U256C6N - Cyclone III FPGA, 5,136 Logic Elements, 256-UBGA | Intel
EP3C5U256C6N โ ActiveSpecification Comparison
| Parameter | EP3C5U256C8N | EP3C5U256C6N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $19.85 | $25.40 |
| Series | Cyclone III | Cyclone III |
| Family Name | Cycloneยฎ III | โ |
| Logic Elements (LE) | 5,136 | โ |
| Number of CLBs | 5,136 | โ |
| Number of Logic Cells | 5,136 | โ |
| Total RAM Bits | 423,936 | โ |
| Number of I/O | 182 | โ |
| Supply Voltage | 1.2 V core, 1.2-3.3 V I/O | โ |
| Number of Embedded Multipliers (18x18) | 46 | โ |
| Number of PLLs | 4 | โ |
| Maximum Operating Frequency | [DATA_NEEDED: maximum operating frequency] | โ |
| Speed Grade | 8 (commercial) | C6 |
| Package | 256-UBGA (Ultra FineLine BGA) | 256-UBGA (Ultra FineLine BGA) |
| Package Dimensions | 14 x 14 mm, 0.8 mm ball pitch | โ |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Lead Free / RoHS | Lead Free, RoHS Compliant | Yes / Compliant |
| Operating Temperature | 0C to +85C (commercial, "C" suffix) | โ |
| Process Technology | 60 nm CMOS, SRAM-based configuration | 60 nm low-power CMOS |
| Device Family | โ | Cyclone III FPGA |
| Logic Elements | โ | 5,136 |
| Logic Array Blocks (LABs) | โ | 321 |
| Embedded Memory | โ | 423,936 bits |
| Maximum User I/Os | โ | 182 |
| Package Body Size | โ | 14 x 14 mm |
| Ball Pitch | โ | 0.80 mm |
| Package Height | โ | 2.20 mm |
| Operating Temperature Grade | โ | Commercial (0C to +85C) |
| Configuration Modes | โ | AS, PS, JTAG, Fast Passive Parallel |