EP3CLS200F780C8ES vs EP3CLS200F780I7 Vergleich
Detaillierter Direktvergleich von EP3CLS200F780C8ES von Intel und EP3CLS200F780I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS200F780C8ES | EP3CLS200F780I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $215,00 | $142,50 |
| Series | Cyclone III LS | Cyclone III LS |
| Family | Cyclone III LS | — |
| Logic Elements (LE) | 198,464 | — |
| Logic Array Blocks (LABs) | 12,404 | 12,040 LAB |
| Embedded Memory (bits) | 8,211,456 | — |
| Maximum User I/O | 413 | — |
| Embedded 18x18 Multipliers | 396 | 396 |
| PLLs | 4 | 4 |
| Process Technology | 65 nm CMOS (low-power) | — |
| Core Supply Voltage | 1.2 V | 1.15 V to 1.25 V |
| Betriebs-Sperrschichttemperatur | -40C to +100C (industrial) | — |
| Maximum Logic Clock Frequency | 402 MHz (typical) | — |
| Gehäuse | 780-ball FBGA (FineLine BGA) | 780-BGA (FBGA) |
| Montageart | Surface Mount (BGA) | Surface Mount (SMD/SMT) |
| RoHS-Status | Compliant (lead-free FBGA) | Compliant |
| Configuration Encryption | AES bitstream encryption (LS feature) | — |
| Speed Grade | 8 | — |
| On-Chip Termination (OCT) | Yes (calibrated) | — |
| Hot Socketing | Supported | — |
| Device Family | — | Cyclone III LS |
| Logic Elements | — | 198,464 |
| Total Memory Bits | — | 8,475 Kbits |
| User I/O Pins | — | 429 |
| Maximum Operating Frequency | — | 274 MHz |
| Package Pins | — | 780 |
| Betriebstemperatur | — | -40 C to +85 C (Industrial) |
| Configuration Modes | — | JTAG, AS, PS, FPP |
| Moisture Sensitivity Level | — | MSL 3 |