EP3CLS200F780C8ES vs EP3CLS200F780I7 Comparación
Comparación detallada lado a lado de EP3CLS200F780C8ES por Intel y EP3CLS200F780I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3CLS200F780C8ES | EP3CLS200F780I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $215,00 | $142,50 |
| Series | Cyclone III LS | Cyclone III LS |
| Family | Cyclone III LS | — |
| Logic Elements (LE) | 198,464 | — |
| Logic Array Blocks (LABs) | 12,404 | 12,040 LAB |
| Embedded Memory (bits) | 8,211,456 | — |
| Maximum User I/O | 413 | — |
| Embedded 18x18 Multipliers | 396 | 396 |
| PLLs | 4 | 4 |
| Process Technology | 65 nm CMOS (low-power) | — |
| Core Supply Voltage | 1.2 V | 1.15 V to 1.25 V |
| Temperatura de unión de funcionamiento | -40C to +100C (industrial) | — |
| Maximum Logic Clock Frequency | 402 MHz (typical) | — |
| Encapsulado | 780-ball FBGA (FineLine BGA) | 780-BGA (FBGA) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (SMD/SMT) |
| Estado RoHS | Compliant (lead-free FBGA) | Compliant |
| Configuration Encryption | AES bitstream encryption (LS feature) | — |
| Speed Grade | 8 | — |
| On-Chip Termination (OCT) | Yes (calibrated) | — |
| Hot Socketing | Supported | — |
| Device Family | — | Cyclone III LS |
| Logic Elements | — | 198,464 |
| Total Memory Bits | — | 8,475 Kbits |
| User I/O Pins | — | 429 |
| Maximum Operating Frequency | — | 274 MHz |
| Package Pins | — | 780 |
| Temperatura de funcionamiento | — | -40 C to +85 C (Industrial) |
| Configuration Modes | — | JTAG, AS, PS, FPP |
| Moisture Sensitivity Level | — | MSL 3 |