EP3SE110F780C2 vs EP3SE80F780C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F780C2 sa pamamagitan ng Intel at EP3SE80F780C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE110F780C2 | EP3SE80F780C2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III E (Enhanced) | Stratix III E |
| Series | EP3SE110 | — |
| Logic Elements (LE) | 107,500 | — |
| Embedded Memory | 8,936,448 bits (8.93 Mbit) | — |
| Maximum User I/O | 488 | — |
| Embedded Multipliers | 768 (18x18) | — |
| PLLs | 4 | — |
| Process Node | 65 nm | — |
| Core Voltage (VCCINT) | 1.1 V | — |
| Packhaging | 780-BBGA, FCBGA (FineLine) | 780-Ball FC-FBGA (Flip-Chip BGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | 0C to +85C (Commercial) | — |
| Speed Grade | C2 | — |
| Tindminan RoHS | Compliant | Compliant |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | LVDS, LVPECL, HSTL, SSTL, LVTTL, LVCMOS, PCI, PCI-X |
| Logic Elements | — | 80,000 |
| Embedded Memory Bits | — | 6,843,392 bits |
| User I/Os | — | 488 |
| Logic Array Blocks (LABs) | — | 3,200 |
| DSP Blocks | — | 320 |
| Process Technology | — | 65 nm |
| Core Voltage | — | 1.1 V |
| Maximum Core Clock | — | 600 MHz |
| Configuration Mode | — | Active serial (AS), Passive serial (PS), JTAG, Fast passive parallel (FPP) |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Lead-Free | — | Yes |
| Number of PLLs | — | 12 |