EP3SE260F1152C2N vs EP3SE260F1152C4N Vergleich

Detaillierter Direktvergleich von EP3SE260F1152C2N von Intel und EP3SE260F1152C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE260F1152C2N EP3SE260F1152C4N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $11.000,00 $1.620,00
Series Stratix III E Stratix III E
Family FPGA - Field Programmable Gate Array Stratix III (Enhanced)
Number of Logic Elements 255000 —
Number of LABs/CLBs 10200 10,200
Total Memory Bits 16672768 —
Number of I/O 744 —
Voltage - Supply 1.1 V —
Montageart Surface Mount Surface Mount (BGA)
Betriebstemperatur [DATA_NEEDED: operating temperature grade] 0C to +85C (commercial, 'C' suffix)
Gehäuse / Bauform 1152-BBGA, FCBGA —
Process Technology 65 nm 65 nm CMOS
Maximum Frequency 600 MHz —
Supplier Device Package 1152-FCBGA —
MSL-Level [DATA_NEEDED: MSL rating] —
RoHS-Status Compliant —
Lead Free Yes (per EP3SE260F1152C2G comparison) —
ECCN [DATA_NEEDED: ECCN code] —
Moisture Sensitivity [DATA_NEEDED: MSL level] —
Logic Elements (LEs) — 255,000
Embedded Memory — 16,672,768 bits (16.67 Mbit)
Maximum User I/Os — 744
DSP / 18x18 Multipliers — 768 embedded multipliers
Core Voltage — 1.1 V
Maximum Operating Frequency — 450 MHz
Gehäuse — 1152-ball FC-FBGA (flip-chip)
Speed Grade — -4 (commercial temperature)
Packaging — Tray
Lead-Free / RoHS — Lead-free finish (RoHS compliant per distributor listing)
Speichertyp — SRAM-based, volatile (requires configuration device)
Configuration — External EPCS / enhanced configuration via AS, PS, JTAG, or FPP
Product Status — Obsolete (per Xecor cross-reference data)

Datenblätter & Ressourcen

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