EP3SE260F1152C2N vs EP3SE260F1152C4N Comparison

Detailed side-by-side comparison of EP3SE260F1152C2N by Intel and EP3SE260F1152C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE260F1152C2N EP3SE260F1152C4N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $11,000.00 $1,620.00
Series Stratix III E Stratix III E
Family FPGA - Field Programmable Gate Array Stratix III (Enhanced)
Number of Logic Elements 255000 β€”
Number of LABs/CLBs 10200 10,200
Total Memory Bits 16672768 β€”
Number of I/O 744 β€”
Voltage - Supply 1.1 V β€”
Mounting Type Surface Mount Surface Mount (BGA)
Operating Temperature [DATA_NEEDED: operating temperature grade] 0C to +85C (commercial, 'C' suffix)
Package / Case 1152-BBGA, FCBGA β€”
Process Technology 65 nm 65 nm CMOS
Maximum Frequency 600 MHz β€”
Supplier Device Package 1152-FCBGA β€”
MSL Level [DATA_NEEDED: MSL rating] β€”
RoHS Status Compliant β€”
Lead Free Yes (per EP3SE260F1152C2G comparison) β€”
ECCN [DATA_NEEDED: ECCN code] β€”
Moisture Sensitivity [DATA_NEEDED: MSL level] β€”
Logic Elements (LEs) β€” 255,000
Embedded Memory β€” 16,672,768 bits (16.67 Mbit)
Maximum User I/Os β€” 744
DSP / 18x18 Multipliers β€” 768 embedded multipliers
Core Voltage β€” 1.1 V
Maximum Operating Frequency β€” 450 MHz
Package β€” 1152-ball FC-FBGA (flip-chip)
Speed Grade β€” -4 (commercial temperature)
Packaging β€” Tray
Lead-Free / RoHS β€” Lead-free finish (RoHS compliant per distributor listing)
Memory Type β€” SRAM-based, volatile (requires configuration device)
Configuration β€” External EPCS / enhanced configuration via AS, PS, JTAG, or FPP
Product Status β€” Obsolete (per Xecor cross-reference data)

Datasheets & Resources

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