EP3SE260F1152C4 vs EP3SE260F1152C2 Vergleich

Detaillierter Direktvergleich von EP3SE260F1152C4 von Intel und EP3SE260F1152C2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE260F1152C4 EP3SE260F1152C2
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $8.900,00 $2.400,00
Series Stratix III E (Enhanced) Stratix® III E
Family Stratix III —
Logic Elements (LE) 255,000 255,000
Logic Array Blocks (LABs) 10,200 10,200
Embedded Memory Bits 16,672,768 —
User I/O Count 744 —
Process Technology 65 nm CMOS (TSMC) 65 nm CMOS
Core Voltage 1.1 V —
Speed Grade C4 (slowest commercial grade) C2 (commercial)
Maximum Internal Frequency ~450 MHz (per FPGAkey listing) —
Gehäuse 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) 1152-ball FC-FBGA (Flip Chip)
Package Code BGA, square —
I/O Standards Supported LVDS, LVTTL, LVCMOS, SSTL, HSTL —
Configuration Modes Passive Serial, Fast Passive Parallel, JTAG —
DSP Blocks (18x18 Multipliers) 384 —
PLL Count [DATA_NEEDED: PLL count] —
Transceivers External PHY interface only (no integrated GXB) —
RoHS-Status Compliant (per distributor listings) Compliant
Betriebstemperatur Commercial (0C to +85C) - inferred from speed grade C4 Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits]
Montageart Surface Mount (BGA) Surface Mount
Manufacturer — Intel (formerly Altera)
Embedded Memory (bits) — 16,672,768
User I/Os — 744
User I/O Banks — [DATA_NEEDED: I/O bank count]
Core Voltage (VCCINT) — 1.1 V
Lead-Free — Yes
MSL-Level — [DATA_NEEDED: MSL rating]
Design Software — Quartus II (Stratix III support)

Datenblätter & Ressourcen

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