EP3SE260F1152C4 vs EP3SE260F1152C2 Comparison

Detailed side-by-side comparison of EP3SE260F1152C4 by Intel and EP3SE260F1152C2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE260F1152C4 EP3SE260F1152C2
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $8,900.00 $2,400.00
Series Stratix III E (Enhanced) Stratixยฎ III E
Family Stratix III โ€”
Logic Elements (LE) 255,000 255,000
Logic Array Blocks (LABs) 10,200 10,200
Embedded Memory Bits 16,672,768 โ€”
User I/O Count 744 โ€”
Process Technology 65 nm CMOS (TSMC) 65 nm CMOS
Core Voltage 1.1 V โ€”
Speed Grade C4 (slowest commercial grade) C2 (commercial)
Maximum Internal Frequency ~450 MHz (per FPGAkey listing) โ€”
Package 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) 1152-ball FC-FBGA (Flip Chip)
Package Code BGA, square โ€”
I/O Standards Supported LVDS, LVTTL, LVCMOS, SSTL, HSTL โ€”
Configuration Modes Passive Serial, Fast Passive Parallel, JTAG โ€”
DSP Blocks (18x18 Multipliers) 384 โ€”
PLL Count [DATA_NEEDED: PLL count] โ€”
Transceivers External PHY interface only (no integrated GXB) โ€”
RoHS Status Compliant (per distributor listings) Compliant
Operating Temperature Commercial (0C to +85C) - inferred from speed grade C4 Commercial (0 ยฐC to +85 ยฐC junction) [DATA_NEEDED: exact TJ limits]
Mounting Type Surface Mount (BGA) Surface Mount
Manufacturer โ€” Intel (formerly Altera)
Embedded Memory (bits) โ€” 16,672,768
User I/Os โ€” 744
User I/O Banks โ€” [DATA_NEEDED: I/O bank count]
Core Voltage (VCCINT) โ€” 1.1 V
Lead-Free โ€” Yes
MSL Level โ€” [DATA_NEEDED: MSL rating]
Design Software โ€” Quartus II (Stratix III support)

Datasheets & Resources

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