EP3SE260F1152C4 vs EP3SE260F1152C3N Vergleich
Detaillierter Direktvergleich von EP3SE260F1152C4 von Intel und EP3SE260F1152C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N ✓ AktivSpezifikationsvergleich
| Parameter | EP3SE260F1152C4 | EP3SE260F1152C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $8.900,00 | $7.500,00 |
| Series | Stratix III E (Enhanced) | Stratix III E |
| Family | Stratix III | — |
| Logic Elements (LE) | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Embedded Memory Bits | 16,672,768 | 16,672,768 bits |
| User I/O Count | 744 | 744 |
| Process Technology | 65 nm CMOS (TSMC) | 65 nm |
| Core Voltage | 1.1 V | 1.1 V |
| Speed Grade | C4 (slowest commercial grade) | — |
| Maximum Internal Frequency | ~450 MHz (per FPGAkey listing) | — |
| Gehäuse | 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) | 1152-BBGA, FCBGA |
| Package Code | BGA, square | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG | AS, AP, PS, FPP, JTAG |
| DSP Blocks (18x18 Multipliers) | 384 | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Transceivers | External PHY interface only (no integrated GXB) | Integrated high-speed transceivers |
| RoHS-Status | Compliant (per distributor listings) | Compliant |
| Betriebstemperatur | Commercial (0C to +85C) - inferred from speed grade C4 | 0 C to +85 C (Commercial) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Logic Elements / Cells | — | 255,000 |
| DSP Blocks | — | Yes (dedicated multiplier/accumulator) |
| Embedded Memory Type | — | TriMatrix (true dual-port, FIFO, ROM, RAM) |
| External Memory Support | — | DDR3, DDR2, QDR II+, RLDRAM II |
| Partial Reconfiguration | — | Supported |
| Programmable Power Technology | — | Yes (up to 50% dynamic power reduction) |