EP3SE260F1152C4 vs EP3SE260F1152C3N Comparison

Detailed side-by-side comparison of EP3SE260F1152C4 by Intel and EP3SE260F1152C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE260F1152C4 EP3SE260F1152C3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Active
Stock Status In Stock In Stock
Unit Price (USD) $8,900.00 $7,500.00
Series Stratix III E (Enhanced) Stratix III E
Family Stratix III β€”
Logic Elements (LE) 255,000 β€”
Logic Array Blocks (LABs) 10,200 10,200
Embedded Memory Bits 16,672,768 16,672,768 bits
User I/O Count 744 744
Process Technology 65 nm CMOS (TSMC) 65 nm
Core Voltage 1.1 V 1.1 V
Speed Grade C4 (slowest commercial grade) β€”
Maximum Internal Frequency ~450 MHz (per FPGAkey listing) β€”
Package 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) 1152-BBGA, FCBGA
Package Code BGA, square β€”
I/O Standards Supported LVDS, LVTTL, LVCMOS, SSTL, HSTL β€”
Configuration Modes Passive Serial, Fast Passive Parallel, JTAG AS, AP, PS, FPP, JTAG
DSP Blocks (18x18 Multipliers) 384 β€”
PLL Count [DATA_NEEDED: PLL count] β€”
Transceivers External PHY interface only (no integrated GXB) Integrated high-speed transceivers
RoHS Status Compliant (per distributor listings) Compliant
Operating Temperature Commercial (0C to +85C) - inferred from speed grade C4 0 C to +85 C (Commercial)
Mounting Type Surface Mount (BGA) Surface Mount
Logic Elements / Cells β€” 255,000
DSP Blocks β€” Yes (dedicated multiplier/accumulator)
Embedded Memory Type β€” TriMatrix (true dual-port, FIFO, ROM, RAM)
External Memory Support β€” DDR3, DDR2, QDR II+, RLDRAM II
Partial Reconfiguration β€” Supported
Programmable Power Technology β€” Yes (up to 50% dynamic power reduction)

Datasheets & Resources

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