EP3SE260F1152C4 vs EP3SE260F1152C4N Vergleich
Detaillierter Direktvergleich von EP3SE260F1152C4 von Intel und EP3SE260F1152C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE260F1152C4 | EP3SE260F1152C4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $8.900,00 | $1.620,00 |
| Series | Stratix III E (Enhanced) | Stratix III E |
| Family | Stratix III | Stratix III (Enhanced) |
| Logic Elements (LE) | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Embedded Memory Bits | 16,672,768 | — |
| User I/O Count | 744 | — |
| Process Technology | 65 nm CMOS (TSMC) | 65 nm CMOS |
| Core Voltage | 1.1 V | 1.1 V |
| Speed Grade | C4 (slowest commercial grade) | -4 (commercial temperature) |
| Maximum Internal Frequency | ~450 MHz (per FPGAkey listing) | — |
| Gehäuse | 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) | 1152-ball FC-FBGA (flip-chip) |
| Package Code | BGA, square | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG | — |
| DSP Blocks (18x18 Multipliers) | 384 | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Transceivers | External PHY interface only (no integrated GXB) | — |
| RoHS-Status | Compliant (per distributor listings) | — |
| Betriebstemperatur | Commercial (0C to +85C) - inferred from speed grade C4 | 0C to +85C (commercial, 'C' suffix) |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Logic Elements (LEs) | — | 255,000 |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| Maximum User I/Os | — | 744 |
| Number of LABs/CLBs | — | 10,200 |
| DSP / 18x18 Multipliers | — | 768 embedded multipliers |
| Maximum Operating Frequency | — | 450 MHz |
| Packaging | — | Tray |
| Lead-Free / RoHS | — | Lead-free finish (RoHS compliant per distributor listing) |
| Speichertyp | — | SRAM-based, volatile (requires configuration device) |
| Configuration | — | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP |
| Product Status | — | Obsolete (per Xecor cross-reference data) |