EP3SE260F1152C4 vs EP3SE260F1152C4N Comparison
Detailed side-by-side comparison of EP3SE260F1152C4 by Intel and EP3SE260F1152C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SE260F1152C4 | EP3SE260F1152C4N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $8,900.00 | $1,620.00 |
| Series | Stratix III E (Enhanced) | Stratix III E |
| Family | Stratix III | Stratix III (Enhanced) |
| Logic Elements (LE) | 255,000 | β |
| Logic Array Blocks (LABs) | 10,200 | β |
| Embedded Memory Bits | 16,672,768 | β |
| User I/O Count | 744 | β |
| Process Technology | 65 nm CMOS (TSMC) | 65 nm CMOS |
| Core Voltage | 1.1 V | 1.1 V |
| Speed Grade | C4 (slowest commercial grade) | -4 (commercial temperature) |
| Maximum Internal Frequency | ~450 MHz (per FPGAkey listing) | β |
| Package | 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) | 1152-ball FC-FBGA (flip-chip) |
| Package Code | BGA, square | β |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | β |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG | β |
| DSP Blocks (18x18 Multipliers) | 384 | β |
| PLL Count | [DATA_NEEDED: PLL count] | β |
| Transceivers | External PHY interface only (no integrated GXB) | β |
| RoHS Status | Compliant (per distributor listings) | β |
| Operating Temperature | Commercial (0C to +85C) - inferred from speed grade C4 | 0C to +85C (commercial, 'C' suffix) |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| Logic Elements (LEs) | β | 255,000 |
| Embedded Memory | β | 16,672,768 bits (16.67 Mbit) |
| Maximum User I/Os | β | 744 |
| Number of LABs/CLBs | β | 10,200 |
| DSP / 18x18 Multipliers | β | 768 embedded multipliers |
| Maximum Operating Frequency | β | 450 MHz |
| Packaging | β | Tray |
| Lead-Free / RoHS | β | Lead-free finish (RoHS compliant per distributor listing) |
| Memory Type | β | SRAM-based, volatile (requires configuration device) |
| Configuration | β | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP |
| Product Status | β | Obsolete (per Xecor cross-reference data) |