EP3SE260F1152C4 vs EP3SE260F1152C4N 비교

다음의 상세 나란히 비교: EP3SE260F1152C4 제조: Intel 및 EP3SE260F1152C4N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

사양 비교

파라미터 EP3SE260F1152C4 EP3SE260F1152C4N
브랜드 Intel Intel
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 NRND Obsolete
재고 상태 In Stock In Stock
단가 (USD) $8,900.00 $1,620.00
Series Stratix III E (Enhanced) Stratix III E
Family Stratix III Stratix III (Enhanced)
Logic Elements (LE) 255,000 —
Logic Array Blocks (LABs) 10,200 —
Embedded Memory Bits 16,672,768 —
User I/O Count 744 —
Process Technology 65 nm CMOS (TSMC) 65 nm CMOS
Core Voltage 1.1 V 1.1 V
Speed Grade C4 (slowest commercial grade) -4 (commercial temperature)
Maximum Internal Frequency ~450 MHz (per FPGAkey listing) —
패키지 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) 1152-ball FC-FBGA (flip-chip)
Package Code BGA, square —
I/O Standards Supported LVDS, LVTTL, LVCMOS, SSTL, HSTL —
Configuration Modes Passive Serial, Fast Passive Parallel, JTAG —
DSP Blocks (18x18 Multipliers) 384 —
PLL Count [DATA_NEEDED: PLL count] —
Transceivers External PHY interface only (no integrated GXB) —
RoHS 상태 Compliant (per distributor listings) —
동작 온도 Commercial (0C to +85C) - inferred from speed grade C4 0C to +85C (commercial, 'C' suffix)
실장 유형 Surface Mount (BGA) Surface Mount (BGA)
Logic Elements (LEs) — 255,000
Embedded Memory — 16,672,768 bits (16.67 Mbit)
Maximum User I/Os — 744
Number of LABs/CLBs — 10,200
DSP / 18x18 Multipliers — 768 embedded multipliers
Maximum Operating Frequency — 450 MHz
Packaging — Tray
Lead-Free / RoHS — Lead-free finish (RoHS compliant per distributor listing)
메모리 유형 — SRAM-based, volatile (requires configuration device)
Configuration — External EPCS / enhanced configuration via AS, PS, JTAG, or FPP
Product Status — Obsolete (per Xecor cross-reference data)

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