EP3SE260F1152C4N vs EP3SE260F1152C2N Vergleich

Detaillierter Direktvergleich von EP3SE260F1152C4N von Intel und EP3SE260F1152C2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE260F1152C4N EP3SE260F1152C2N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.620,00 $11.000,00
Series Stratix III E Stratix III E
Family Stratix III (Enhanced) FPGA - Field Programmable Gate Array
Logic Elements (LEs) 255,000 —
Embedded Memory 16,672,768 bits (16.67 Mbit) —
Maximum User I/Os 744 —
Number of LABs/CLBs 10,200 10200
DSP / 18x18 Multipliers 768 embedded multipliers —
Process Technology 65 nm CMOS 65 nm
Core Voltage 1.1 V —
Maximum Operating Frequency 450 MHz —
Gehäuse 1152-ball FC-FBGA (flip-chip) —
Speed Grade -4 (commercial temperature) —
Betriebstemperatur 0C to +85C (commercial, 'C' suffix) [DATA_NEEDED: operating temperature grade]
Montageart Surface Mount (BGA) Surface Mount
Packaging Tray —
Lead-Free / RoHS Lead-free finish (RoHS compliant per distributor listing) —
Speichertyp SRAM-based, volatile (requires configuration device) —
Configuration External EPCS / enhanced configuration via AS, PS, JTAG, or FPP —
Product Status Obsolete (per Xecor cross-reference data) —
Number of Logic Elements — 255000
Total Memory Bits — 16672768
Number of I/O — 744
Voltage - Supply — 1.1 V
Gehäuse / Bauform — 1152-BBGA, FCBGA
Maximum Frequency — 600 MHz
Supplier Device Package — 1152-FCBGA
MSL-Level — [DATA_NEEDED: MSL rating]
RoHS-Status — Compliant
Lead Free — Yes (per EP3SE260F1152C2G comparison)
ECCN — [DATA_NEEDED: ECCN code]
Moisture Sensitivity — [DATA_NEEDED: MSL level]

Datenblätter & Ressourcen

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