EP3SE260H780I4N vs EP3SE260H780C2 Vergleich
Detaillierter Direktvergleich von EP3SE260H780I4N von Intel und EP3SE260H780C2 von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel
EP3SE260H780I4N ⚠ Letzte BestellmöglichkeitAltera
EP3SE260H780C2 - Stratix III E 260K LE FPGA | Altera | 780-BGA
EP3SE260H780C2 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE260H780I4N | EP3SE260H780C2 |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.150,00 | $2.150,00 |
| Family | Stratix III Enhanced (Stratix III E) | Stratix® III E |
| Logic Elements | 255,000 | — |
| Embedded Memory Bits | 16,672,768 bits | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| User I/Os | 488 | 488 |
| Process Technology | 65 nm | — |
| Core Voltage | 1.1 V | 0.86 V to 1.15 V |
| Maximum Operating Frequency | 450 MHz | — |
| Gehäuse | 780-pin FC-HFBGA (FCBGA) | 780-BBGA, FCBGA |
| Package Dimensions | 33 mm x 33 mm | — |
| Ball Pitch | [DATA_NEEDED: BGA ball pitch in mm] | — |
| Betriebstemperatur | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Configuration Modes | AS, PS, JTAG, FPP | — |
| Boundary Scan | IEEE Std. 1149.1 (JTAG) | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| Series | — | Stratix III |
| Logic Elements (LE) | — | 255,000 |
| Adaptive Logic Modules (ALM) | — | 102,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| Number of LABs/CLBs | — | 10,200 |
| Process Node | — | 65 nm |
| Montageart | — | Surface Mount |
| Lead Free | — | Yes |
| MSL-Level | — | 3 (per JEDEC J-STD-020) |