EP3SE260H780I4N vs EP3SE260H780C2 Comparación
Comparación detallada lado a lado de EP3SE260H780I4N por Intel y EP3SE260H780C2 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel
EP3SE260H780I4N ⚠ Última compraAltera
EP3SE260H780C2 - Stratix III E 260K LE FPGA | Altera | 780-BGA
EP3SE260H780C2 ⚠ Última compraComparación de especificaciones
| Parámetro | EP3SE260H780I4N | EP3SE260H780C2 |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.150,00 | $2.150,00 |
| Family | Stratix III Enhanced (Stratix III E) | Stratix® III E |
| Logic Elements | 255,000 | — |
| Embedded Memory Bits | 16,672,768 bits | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| User I/Os | 488 | 488 |
| Process Technology | 65 nm | — |
| Core Voltage | 1.1 V | 0.86 V to 1.15 V |
| Maximum Operating Frequency | 450 MHz | — |
| Encapsulado | 780-pin FC-HFBGA (FCBGA) | 780-BBGA, FCBGA |
| Package Dimensions | 33 mm x 33 mm | — |
| Ball Pitch | [DATA_NEEDED: BGA ball pitch in mm] | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Configuration Modes | AS, PS, JTAG, FPP | — |
| Boundary Scan | IEEE Std. 1149.1 (JTAG) | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| Series | — | Stratix III |
| Logic Elements (LE) | — | 255,000 |
| Adaptive Logic Modules (ALM) | — | 102,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| Number of LABs/CLBs | — | 10,200 |
| Process Node | — | 65 nm |
| Tipo de montaje | — | Surface Mount |
| Lead Free | — | Yes |
| Nivel MSL | — | 3 (per JEDEC J-STD-020) |