EP3SE260H780I4N vs EP3SE260H780I4L Vergleich
Detaillierter Direktvergleich von EP3SE260H780I4N von Intel und EP3SE260H780I4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel
EP3SE260H780I4N ⚠ Letzte BestellmöglichkeitIntel
EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel
EP3SE260H780I4L ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE260H780I4N | EP3SE260H780I4L |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.150,00 | $1.395,00 |
| Family | Stratix III Enhanced (Stratix III E) | Stratix III E (Enhanced) |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 bits | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| User I/Os | 488 | — |
| Process Technology | 65 nm | 65 nm |
| Core Voltage | 1.1 V | 0.9 V |
| Maximum Operating Frequency | 450 MHz | — |
| Gehäuse | 780-pin FC-HFBGA (FCBGA) | — |
| Package Dimensions | 33 mm x 33 mm | — |
| Ball Pitch | [DATA_NEEDED: BGA ball pitch in mm] | — |
| Betriebstemperatur | -40C to +100C (Industrial) | Industrial, -40C to +85C |
| Configuration Modes | AS, PS, JTAG, FPP | — |
| Boundary Scan | IEEE Std. 1149.1 (JTAG) | — |
| RoHS-Status | Compliant | Compliant (lead-free) |
| Lead-Free | Yes | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| Total Memory Bits | — | 16,672,640 |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| User I/O Count | — | 488 |
| Package Type | — | 780-pin FC-HFBGA (flip-chip BGA) |
| Montageart | — | Surface Mount (flip-chip) |
| Number of Transceivers | — | 24 (family-level maximum, per-pin count depends on variant) |
| Max Transceiver Data Rate | — | 6.375 Gbps (Stratix III E family spec) |
| Number of 18x18 Multipliers | — | [DATA_NEEDED: per-package multiplier count] |
| Configuration Mode | — | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel |
| Pin/Package | — | 780-BBGA, FCBGA (flip-chip) |