EP3SE260H780I4N vs EP3SE260H780I4L 对比

详细并排对比 EP3SE260H780I4N 出自 Intel 和 EP3SE260H780I4L 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SE260H780I4N EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel

EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel

EP3SE260H780I4N ⚠ 最后一次采购
Intel
EP3SE260H780I4L EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L ⚠ 最后一次采购

规格对比

参数 EP3SE260H780I4N EP3SE260H780I4L
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 最后采购期
库存状态 有库存 有库存
单价(USD) $2,150.00 $1,395.00
Family Stratix III Enhanced (Stratix III E) Stratix III E (Enhanced)
Logic Elements 255,000 255,000
Embedded Memory Bits 16,672,768 bits —
Logic Array Blocks (LABs) 10,200 —
User I/Os 488 —
Process Technology 65 nm 65 nm
Core Voltage 1.1 V 0.9 V
Maximum Operating Frequency 450 MHz —
封装 780-pin FC-HFBGA (FCBGA) —
Package Dimensions 33 mm x 33 mm —
Ball Pitch [DATA_NEEDED: BGA ball pitch in mm] —
工作温度 -40C to +100C (Industrial) Industrial, -40C to +85C
Configuration Modes AS, PS, JTAG, FPP —
Boundary Scan IEEE Std. 1149.1 (JTAG) —
RoHS 状态 Compliant Compliant (lead-free)
Lead-Free Yes —
Moisture Sensitivity Level [DATA_NEEDED: MSL rating] —
Total Memory Bits — 16,672,640
Number of LABs/CLBs — [DATA_NEEDED: LAB count]
User I/O Count — 488
Package Type — 780-pin FC-HFBGA (flip-chip BGA)
安装类型 — Surface Mount (flip-chip)
Number of Transceivers — 24 (family-level maximum, per-pin count depends on variant)
Max Transceiver Data Rate — 6.375 Gbps (Stratix III E family spec)
Number of 18x18 Multipliers — [DATA_NEEDED: per-package multiplier count]
Configuration Mode — JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel
Pin/Package — 780-BBGA, FCBGA (flip-chip)

数据手册与资源

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