EP3SE50F780C4L vs EP3SE110F780C4L Vergleich

Detaillierter Direktvergleich von EP3SE50F780C4L von Intel und EP3SE110F780C4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE50F780C4L EP3SE110F780C4L
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.320,00 $1.550,00
Series Stratix III E Stratix III E
Family Stratix III —
Logic Elements (LE) 47,500 —
Embedded Memory 5,760,000 bits —
User I/Os 488 —
DSP Blocks (18x18 multipliers) 304 (19x16) —
Gehäuse 780-ball FCBGA (Flip-Chip BGA) —
Process Node 40 nm —
Core Voltage 1.1 V —
Speed Grade C4 (commercial, speed 4) -4 (commercial)
Lead-Free (L suffix) Yes —
Configuration Method Passive Serial / Fast Passive Parallel / JTAG / Enhanced —
Betriebstemperatur [DATA_NEEDED: full industrial/commercial grade] 0C to +85C (commercial)
RoHS-Status Compliant (lead-free) Compliant
Transceivers [DATA_NEEDED: per Stratix III E variant] —
PLLs [DATA_NEEDED: PLL count] —
Number of Logic Elements (LE) — 107,500
Number of Logic Array Blocks (LAB) — [DATA_NEEDED: number of LABs]
Total Memory Bits — 8,936,448 bits
Number of 18x18 Multipliers — 488
Number of PLLs — [DATA_NEEDED: PLL count]
User I/O Pins — 488
Process Variant — L (low-leakage)
Supply Voltage (Core) — [DATA_NEEDED: core voltage]
Package Type — 780-Ball FCBGA
Ball Pitch — 1.0 mm
Montageart — Surface Mount
Process Technology — 65 nm CMOS
MSL-Level — 3 (per JEDEC J-STD-020)

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