EP3SE50F780C4L vs EP3SE110F780C4L Comparison

Detailed side-by-side comparison of EP3SE50F780C4L by Intel and EP3SE110F780C4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE50F780C4L EP3SE110F780C4L
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Active
Stock Status In Stock In Stock
Unit Price (USD) $1,320.00 $1,550.00
Series Stratix III E Stratix III E
Family Stratix III β€”
Logic Elements (LE) 47,500 β€”
Embedded Memory 5,760,000 bits β€”
User I/Os 488 β€”
DSP Blocks (18x18 multipliers) 304 (19x16) β€”
Package 780-ball FCBGA (Flip-Chip BGA) β€”
Process Node 40 nm β€”
Core Voltage 1.1 V β€”
Speed Grade C4 (commercial, speed 4) -4 (commercial)
Lead-Free (L suffix) Yes β€”
Configuration Method Passive Serial / Fast Passive Parallel / JTAG / Enhanced β€”
Operating Temperature [DATA_NEEDED: full industrial/commercial grade] 0C to +85C (commercial)
RoHS Status Compliant (lead-free) Compliant
Transceivers [DATA_NEEDED: per Stratix III E variant] β€”
PLLs [DATA_NEEDED: PLL count] β€”
Number of Logic Elements (LE) β€” 107,500
Number of Logic Array Blocks (LAB) β€” [DATA_NEEDED: number of LABs]
Total Memory Bits β€” 8,936,448 bits
Number of 18x18 Multipliers β€” 488
Number of PLLs β€” [DATA_NEEDED: PLL count]
User I/O Pins β€” 488
Process Variant β€” L (low-leakage)
Supply Voltage (Core) β€” [DATA_NEEDED: core voltage]
Package Type β€” 780-Ball FCBGA
Ball Pitch β€” 1.0 mm
Mounting Type β€” Surface Mount
Process Technology β€” 65 nm CMOS
MSL Level β€” 3 (per JEDEC J-STD-020)

Datasheets & Resources

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