EP3SE80F1152C4 vs EP3SE80F1152I3N Vergleich
Detaillierter Direktvergleich von EP3SE80F1152C4 von Intel und EP3SE80F1152I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE80F1152I3N - Stratix III E FPGA 80K LE, 1152-FCBGA | Intel
EP3SE80F1152I3N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE80F1152C4 | EP3SE80F1152I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $895,00 | $1.395,00 |
| Series | Stratix III E | — |
| Family | Stratix III Enhanced | Stratix III E |
| Device Type | FPGA | — |
| Logic Elements | 80,000 | 80,000 |
| Logic Array Blocks (LABs) | 3200 | 3,200 |
| Total RAM Bits | 6,843,392 | — |
| User I/Os | 744 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Technology | 65 nm CMOS | 65 nm |
| Internal Frequency (max) | 800 MHz | — |
| Betriebstemperatur | 0C to +85C (Commercial) | -40 °C to +100 °C (Industrial) |
| Gehäuse | 1152-ball FC-FBGA (Fine-pitch Chip-scale BGA) | 1152-ball FCBGA (Flip-Chip BGA) |
| Montageart | Surface Mount | Surface Mount |
| Configuration Method | SRAM-based, JTAG / EPCS serial | — |
| DSP Blocks | Yes (variable-precision, 18x18 multipliers) | — |
| RoHS-Status | Compliant | [DATA_NEEDED: rohs status] |
| Embedded Memory Bits | — | 6,843,392 |
| Maximum User I/O | — | 744 |
| Auxiliary Supply Voltages | — | 1.2 V, 3.3 V |
| Maximum Internal Clock Frequency | — | 500 MHz |
| Speed Grade | — | I3 |
| Configuration Mode | — | JTAG / Passive Serial / Fast Passive Parallel |
| Configuration Encryption | — | AES-128 bitstream encryption supported |