EP3SE80F1152C4 vs EP3SE80F1152I3N Comparación
Comparación detallada lado a lado de EP3SE80F1152C4 por Intel y EP3SE80F1152I3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP3SE80F1152I3N - Stratix III E FPGA 80K LE, 1152-FCBGA | Intel
EP3SE80F1152I3N ⚠ Última compraComparación de especificaciones
| Parámetro | EP3SE80F1152C4 | EP3SE80F1152I3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $895,00 | $1.395,00 |
| Series | Stratix III E | — |
| Family | Stratix III Enhanced | Stratix III E |
| Device Type | FPGA | — |
| Logic Elements | 80,000 | 80,000 |
| Logic Array Blocks (LABs) | 3200 | 3,200 |
| Total RAM Bits | 6,843,392 | — |
| User I/Os | 744 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Technology | 65 nm CMOS | 65 nm |
| Internal Frequency (max) | 800 MHz | — |
| Temperatura de funcionamiento | 0C to +85C (Commercial) | -40 °C to +100 °C (Industrial) |
| Encapsulado | 1152-ball FC-FBGA (Fine-pitch Chip-scale BGA) | 1152-ball FCBGA (Flip-Chip BGA) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration Method | SRAM-based, JTAG / EPCS serial | — |
| DSP Blocks | Yes (variable-precision, 18x18 multipliers) | — |
| Estado RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Embedded Memory Bits | — | 6,843,392 |
| Maximum User I/O | — | 744 |
| Auxiliary Supply Voltages | — | 1.2 V, 3.3 V |
| Maximum Internal Clock Frequency | — | 500 MHz |
| Speed Grade | — | I3 |
| Configuration Mode | — | JTAG / Passive Serial / Fast Passive Parallel |
| Configuration Encryption | — | AES-128 bitstream encryption supported |