EP3SL200F1517I4LN vs EP3SE260F1517I4LN Vergleich
Detaillierter Direktvergleich von EP3SL200F1517I4LN von Intel und EP3SE260F1517I4LN von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel
EP3SE260F1517I4LN ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SL200F1517I4LN | EP3SE260F1517I4LN |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $6.300,00 | $2.895,00 |
| Family | Stratix III L | Stratix III E (Enhanced) |
| Logic Elements | 200,000 | 255,000 |
| Embedded Memory Bits | 10,901,504 | 16,672,768 bits (~2,044 KBytes) |
| Logic Array Blocks (LABs) | 8,000 | 10,200 |
| User I/O Pins | 976 | — |
| Gehäuse | 1517-BBGA, FCBGA | 1517-ball FCBGA (40 mm x 40 mm, 1.0 mm pitch) |
| Process Technology | 65 nm TSMC low-power | 40 nm CMOS |
| Betriebstemperatur | -40C to +100C (Industrial) | -40C to +100C (case, industrial) |
| Montageart | Surface Mount (BGA) | — |
| RoHS-Status | Compliant | — |
| Lead-Free | Yes | — |
| MSL-Level | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Supply Voltage Core | [DATA_NEEDED: VCC core voltage] | — |
| Transceiver Data Rate (max) | [DATA_NEEDED: max transceiver rate] | — |
| DSP Blocks (18x18 multipliers) | 384 | Up to 384 (family-level, device-specific count not in provided data) |
| DSP Performance | 288 GMACS | — |
| Configuration Method | Passive Parallel / Active Serial / JTAG | — |
| Ball Pitch | 1.0 mm | — |
| Package Dimensions | 40 mm x 40 mm | — |
| User I/O Count | — | 976 |
| Speed Grade | — | I4 (industrial, 4th tier) |
| Power Option | — | L (low-power) |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Transceivers | — | Stratix III E family supports up to 24 transceivers up to 8.5 Gbps |
| Partial Reconfiguration | — | Supported |
| Memory Interface Support | — | DDR3, DDR2, QDR II+ (hardened PHY) |
| Configuration Scheme | — | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |