EP3SL200F1517I4LN vs EP3SE260F1517I4LN 对比

详细并排对比 EP3SL200F1517I4LN 出自 Intel 和 EP3SE260F1517I4LN 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SE260F1517I4LN EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel

EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel

EP3SE260F1517I4LN ⚠ 最后一次采购

规格对比

参数 EP3SL200F1517I4LN EP3SE260F1517I4LN
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 最后采购期
库存状态 有库存 有库存
单价(USD) $6,300.00 $2,895.00
Family Stratix III L Stratix III E (Enhanced)
Logic Elements 200,000 255,000
Embedded Memory Bits 10,901,504 16,672,768 bits (~2,044 KBytes)
Logic Array Blocks (LABs) 8,000 10,200
User I/O Pins 976 —
封装 1517-BBGA, FCBGA 1517-ball FCBGA (40 mm x 40 mm, 1.0 mm pitch)
Process Technology 65 nm TSMC low-power 40 nm CMOS
工作温度 -40C to +100C (Industrial) -40C to +100C (case, industrial)
安装类型 Surface Mount (BGA) —
RoHS 状态 Compliant —
Lead-Free Yes —
MSL 等级 [DATA_NEEDED: MSL moisture sensitivity level] —
Supply Voltage Core [DATA_NEEDED: VCC core voltage] —
Transceiver Data Rate (max) [DATA_NEEDED: max transceiver rate] —
DSP Blocks (18x18 multipliers) 384 Up to 384 (family-level, device-specific count not in provided data)
DSP Performance 288 GMACS —
Configuration Method Passive Parallel / Active Serial / JTAG —
Ball Pitch 1.0 mm —
Package Dimensions 40 mm x 40 mm —
User I/O Count — 976
Speed Grade — I4 (industrial, 4th tier)
Power Option — L (low-power)
Lead-Free / RoHS — Yes (N suffix)
Transceivers — Stratix III E family supports up to 24 transceivers up to 8.5 Gbps
Partial Reconfiguration — Supported
Memory Interface Support — DDR3, DDR2, QDR II+ (hardened PHY)
Configuration Scheme — Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG

数据手册与资源

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