EP3SL200F1517I4LN vs EP3SE260F1517I4LN Сравнение
Подробное сравнение бок о бок EP3SL200F1517I4LN от Intel и EP3SE260F1517I4LN от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Intel
EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel
EP3SE260F1517I4LN ⚠ Последняя закупкаСравнение характеристик
| Параметр | EP3SL200F1517I4LN | EP3SE260F1517I4LN |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | NRND | Последняя закупка |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $6.300,00 | $2.895,00 |
| Family | Stratix III L | Stratix III E (Enhanced) |
| Logic Elements | 200,000 | 255,000 |
| Embedded Memory Bits | 10,901,504 | 16,672,768 bits (~2,044 KBytes) |
| Logic Array Blocks (LABs) | 8,000 | 10,200 |
| User I/O Pins | 976 | — |
| Корпус | 1517-BBGA, FCBGA | 1517-ball FCBGA (40 mm x 40 mm, 1.0 mm pitch) |
| Process Technology | 65 nm TSMC low-power | 40 nm CMOS |
| Рабочая температура | -40C to +100C (Industrial) | -40C to +100C (case, industrial) |
| Тип монтажа | Surface Mount (BGA) | — |
| Статус RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Уровень MSL | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Supply Voltage Core | [DATA_NEEDED: VCC core voltage] | — |
| Transceiver Data Rate (max) | [DATA_NEEDED: max transceiver rate] | — |
| DSP Blocks (18x18 multipliers) | 384 | Up to 384 (family-level, device-specific count not in provided data) |
| DSP Performance | 288 GMACS | — |
| Configuration Method | Passive Parallel / Active Serial / JTAG | — |
| Ball Pitch | 1.0 mm | — |
| Package Dimensions | 40 mm x 40 mm | — |
| User I/O Count | — | 976 |
| Speed Grade | — | I4 (industrial, 4th tier) |
| Power Option | — | L (low-power) |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Transceivers | — | Stratix III E family supports up to 24 transceivers up to 8.5 Gbps |
| Partial Reconfiguration | — | Supported |
| Memory Interface Support | — | DDR3, DDR2, QDR II+ (hardened PHY) |
| Configuration Scheme | — | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |