EP3SL200H780C4L vs EP3SL200H780C3N Vergleich

Detaillierter Direktvergleich von EP3SL200H780C4L von Intel und EP3SL200H780C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SL200H780C4L EP3SL200H780C3N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $6.459,35 $4.995,00
Manufacturer Intel (formerly Altera) —
Series Stratix III —
Device Type FPGA - Field Programmable Gate Array —
Logic Elements 200,000 200,000
Embedded Memory 6.5 Mbit —
User I/O Count 488 —
Package Type 780-ball FCBGA (FineLine BGA, HBGA) —
Package Code BGA-780 / PBGA780 / HBGA-780 —
Package Mounting Surface Mount —
Internal Logic Frequency up to 717 MHz (per ampheo datasheet brief) —
Speed Grade -4 (medium performance, commercial) C3 (commercial, -3 speed)
Betriebstemperatur 0C to 85C (commercial) 0C to +85C (commercial)
Lead-Free / Pb-Free Yes (L suffix, lead-free) —
RoHS-Status Compliant —
Process Technology TSMC 40 nm —
Configuration Modes FPP, AS, PS, JTAG —
Family — Stratix III L (low-power)
Process Node — 40 nm
Embedded Memory Bits — 10,901,504 bits
Logic Array Blocks (LABs) — 8,000
User I/Os — 488
Gehäuse — 780-Ball FCBGA (HBGA), 29 x 29 mm
Montageart — Surface Mount
Maximum Internal Clock Frequency — 800 MHz
Transceivers — 24 channels, up to 3.75 Gbps
DSP Blocks — 384
Voltage - Core — 0.9 V / 1.0 V (core, VCC)
Voltage - I/O — 1.2 V to 3.3 V (VCCIO banks)
MSL-Level — 3
Lead-Free / RoHS — Yes
Mounting Pitch — 1.0 mm ball pitch
PLLs — 12 (Stratix III PLL array)
Configuration — JTAG IEEE Std 1149.1, passive/active serial

Datenblätter & Ressourcen

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