EP3SL200H780C4L vs EP3SL200H780I4LN Vergleich
Detaillierter Direktvergleich von EP3SL200H780C4L von Intel und EP3SL200H780I4LN von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SL200H780C4L | EP3SL200H780I4LN |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $6.459,35 | $1.280,00 |
| Manufacturer | Intel (formerly Altera) | Intel / Altera (now Intel PSG) |
| Series | Stratix III | Stratix III L |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 200,000 | — |
| Embedded Memory | 6.5 Mbit | — |
| User I/O Count | 488 | — |
| Package Type | 780-ball FCBGA (FineLine BGA, HBGA) | — |
| Package Code | BGA-780 / PBGA780 / HBGA-780 | — |
| Package Mounting | Surface Mount | — |
| Internal Logic Frequency | up to 717 MHz (per ampheo datasheet brief) | — |
| Speed Grade | -4 (medium performance, commercial) | I4 (Industrial, mid-speed grade) |
| Betriebstemperatur | 0C to 85C (commercial) | -40C to +100C (industrial) |
| Lead-Free / Pb-Free | Yes (L suffix, lead-free) | — |
| RoHS-Status | Compliant | RoHS Compliant (lead-free) |
| Process Technology | TSMC 40 nm | 65 nm CMOS |
| Configuration Modes | FPP, AS, PS, JTAG | — |
| Family | — | Stratix III L (Low-Power) |
| Number of Logic Elements / Cells | — | 200,000 |
| Number of LABs / CLBs | — | 8,000 |
| Total RAM Bits | — | 10,901,504 (approximately 10.9 Mbit) |
| Number of I/O | — | 488 |
| Voltage - Supply | — | 0.9 V core (selectable Vcore) |
| Montageart | — | Surface Mount |
| Gehäuse / Bauform | — | 780-BBGA, FCBGA (Flip-Chip BGA) |
| MSL-Level | — | MSL 3 (168 Hours, per JEDEC J-STD-020) |
| Roaming Pin Name Suffix | — | LN = lead-free, industrial temp, H780 780-ball package |